SBOS766B February   2016  – February 2016 THS3217

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: D2S
    6. 7.6  Electrical Characteristics: OPS
    7. 7.7  Electrical Characteristics: D2S + OPS
    8. 7.8  Electrical Characteristics: Midscale (DC) Reference Buffer
    9. 7.9  Typical Characteristics: D2S + OPS
    10. 7.10 Typical Characteristics: D2S Only
    11. 7.11 Typical Characteristics: OPS only
    12. 7.12 Typical Characteristics: Midscale (DC) Reference Buffer
    13. 7.13 Typical Characteristics: Switching Performance
    14. 7.14 Typical Characteristics: Miscellaneous Performance
  8. 8 Parameter Measurement Information
    1. 8.1 Overview
    2. 8.2 Frequency Response Measurement
    3. 8.3 Harmonic Distortion Measurement
    4. 8.4 Noise Measurement
    5. 8.5 Output Impedance Measurement
    6. 8.6 Step-Response Measurement
    7. 8.7 Feedthrough Measurement
    8. 8.8 Midscale Buffer ROUT Versus CLOAD Measurement
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Differential to Single-Ended Stage (D2S) With Fixed Gain of 2-V/V (Pins 2, 3, 6 and 14)
      2. 9.3.2 Midscale (DC) Reference Buffer (Pin 1 and Pin 15)
      3. 9.3.3 Output Power Stage (OPS) (Pins 4, 7, 9, 10, 11, and 12)
        1. 9.3.3.1 Output DC Offset and Drift for the OPS
        2. 9.3.3.2 OPS Harmonic Distortion (HD) Performance
        3. 9.3.3.3 Switch Feedthrough to the OPS
        4. 9.3.3.4 Driving Capacitive Loads
      4. 9.3.4 Digital Control Lines
    4. 9.4 Device Functional Modes
      1. 9.4.1 Full-Signal Path Mode
        1. 9.4.1.1 Internal Connection With Fixed Common-Mode Output Voltage
        2. 9.4.1.2 Internal Connection With Adjustable Common-Mode Output Voltage
        3. 9.4.1.3 External Connection
      2. 9.4.2 Dual-Output Mode
      3. 9.4.3 Differential I/O Voltage Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Typical Applications
        1. 10.1.1.1 High-Frequency, High-Voltage, Dual-Output Line Driver for AWGs
          1. 10.1.1.1.1 Design Requirements
          2. 10.1.1.1.2 Detailed Design Procedure
          3. 10.1.1.1.3 Application Curves
        2. 10.1.1.2 High-Voltage Pulse-Generator
          1. 10.1.1.2.1 Design Requirements
          2. 10.1.1.2.2 Detailed Design Procedure
          3. 10.1.1.2.3 Application Curves
        3. 10.1.1.3 Single-Supply, AC-Coupled, Piezo Element Driver
          1. 10.1.1.3.1 Design Requirements
        4. 10.1.1.4 Output Common-Mode Control Using the Midscale Buffer as a Level Shifter
          1. 10.1.1.4.1 Design Requirements
        5. 10.1.1.5 Differential I/O Driver With independent Common-Mode Control
          1. 10.1.1.5.1 Design Requirements
  11. 11Power Supply Recommendations
    1. 11.1 Thermal Considerations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
        1. 13.1.1.1 TINA-TI (Free Software Download)
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Input Stage: Internal Gain of 2-V/V
    • Buffered Differential Inputs
    • Single-Ended Low Impedance Output
    • Full-Power Bandwidth: 500-MHz (2 VPP)
  • Output Stage: Gain Externally Configurable
    • Full-Power Bandwidth: 500-MHz (5 VPP)
    • Slew Rate: 5000 V/µs
    • SPDT Input Switch / Multiplexer
  • Full Signal Path: Input Stage + Output Stage
    • HD2 (20 MHz, 5 VPP to 100-Ω Load): –60 dBc
    • HD3 (20 MHz, 5 VPP to 100-Ω Load): –75 dBc
    • 10-VPP Output to 100-Ω Load Using Split
      ±6.5-V Supply
    • 12-VPP Output to Heavy Capacitive Loads Using Single 15-V Supply
  • Internal DC Reference Buffer with Low Impedance Output
  • Power-Supply Range:
    • Split Supply: ±4 V to ±7.9 V
    • Single Supply: 8 V to 15.8 V

2 Applications

  • Digital to Analog Converter (DAC) Output Amplifier
  • Wideband Arbitrary Waveform Generator (AWG) Output Driver
  • Predriver to > 20-VPP Output Amplifier (THS3091)
  • Single-Supply, High-Capacitive Load Driver for Piezo Elements

3 Description

The THS3217 combines the key signal-chain components required to interface with a complementary-current output, digital-to-analog converter (DAC). The flexibility provided by this two-stage amplifier system delivers the low distortion, dc-coupled, differential to single-ended signal processing required by a wide range of systems. The input stage buffers the DAC resistive termination, and converts the signal from differential to single-ended with a fixed gain of 2 V/V. The differential to single-ended output is available externally for direct use, and can also be connected through an RLC filter or attenuator to the input of an internal output power stage (OPS). The wideband, current-feedback, output power stage provides all pins externally for flexible gain setting.

An internal 2×1 multiplexer (mux) to the output power stage noninverting input provides an easy means to select between the internal differential-to-single-ended stage (D2S) output or an external input.

An optional on-chip midsupply buffer provides a wideband, low-output-impedance source for biasing during single-supply operation through the signal-path stages. This feature provides very simple biasing for single-supply, ac-coupled applications operating up to a maximum 15.8-V supply. An external input to this buffer allows for a dc error-correction loop, or a simple output dc offset feature.

A companion device, the THS3215, provides the same functional features at lower quiescent power and bandwidth. The THS3217 and the THS3215 support the emerging high-speed Texas Instruments DACs for AWG applications, such as the DAC38J82.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
THS3217 VQFN (16) 4.00 mm × 4.00 mm
  1. For all available packages, see the package option addendum at the end of the data sheet.

Gain = 5 V/V, Differential-to-Single-Ended Line Driver With Optional External Filter

THS3217 simp_schem_sbos766.gif