SBOS766B February   2016  – February 2016 THS3217

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: D2S
    6. 7.6  Electrical Characteristics: OPS
    7. 7.7  Electrical Characteristics: D2S + OPS
    8. 7.8  Electrical Characteristics: Midscale (DC) Reference Buffer
    9. 7.9  Typical Characteristics: D2S + OPS
    10. 7.10 Typical Characteristics: D2S Only
    11. 7.11 Typical Characteristics: OPS only
    12. 7.12 Typical Characteristics: Midscale (DC) Reference Buffer
    13. 7.13 Typical Characteristics: Switching Performance
    14. 7.14 Typical Characteristics: Miscellaneous Performance
  8. 8 Parameter Measurement Information
    1. 8.1 Overview
    2. 8.2 Frequency Response Measurement
    3. 8.3 Harmonic Distortion Measurement
    4. 8.4 Noise Measurement
    5. 8.5 Output Impedance Measurement
    6. 8.6 Step-Response Measurement
    7. 8.7 Feedthrough Measurement
    8. 8.8 Midscale Buffer ROUT Versus CLOAD Measurement
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Differential to Single-Ended Stage (D2S) With Fixed Gain of 2-V/V (Pins 2, 3, 6 and 14)
      2. 9.3.2 Midscale (DC) Reference Buffer (Pin 1 and Pin 15)
      3. 9.3.3 Output Power Stage (OPS) (Pins 4, 7, 9, 10, 11, and 12)
        1. 9.3.3.1 Output DC Offset and Drift for the OPS
        2. 9.3.3.2 OPS Harmonic Distortion (HD) Performance
        3. 9.3.3.3 Switch Feedthrough to the OPS
        4. 9.3.3.4 Driving Capacitive Loads
      4. 9.3.4 Digital Control Lines
    4. 9.4 Device Functional Modes
      1. 9.4.1 Full-Signal Path Mode
        1. 9.4.1.1 Internal Connection With Fixed Common-Mode Output Voltage
        2. 9.4.1.2 Internal Connection With Adjustable Common-Mode Output Voltage
        3. 9.4.1.3 External Connection
      2. 9.4.2 Dual-Output Mode
      3. 9.4.3 Differential I/O Voltage Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Typical Applications
        1. 10.1.1.1 High-Frequency, High-Voltage, Dual-Output Line Driver for AWGs
          1. 10.1.1.1.1 Design Requirements
          2. 10.1.1.1.2 Detailed Design Procedure
          3. 10.1.1.1.3 Application Curves
        2. 10.1.1.2 High-Voltage Pulse-Generator
          1. 10.1.1.2.1 Design Requirements
          2. 10.1.1.2.2 Detailed Design Procedure
          3. 10.1.1.2.3 Application Curves
        3. 10.1.1.3 Single-Supply, AC-Coupled, Piezo Element Driver
          1. 10.1.1.3.1 Design Requirements
        4. 10.1.1.4 Output Common-Mode Control Using the Midscale Buffer as a Level Shifter
          1. 10.1.1.4.1 Design Requirements
        5. 10.1.1.5 Differential I/O Driver With independent Common-Mode Control
          1. 10.1.1.5.1 Design Requirements
  11. 11Power Supply Recommendations
    1. 11.1 Thermal Considerations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
        1. 13.1.1.1 TINA-TI (Free Software Download)
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage Supply, +VCC – (–VCC) 16.2 V
Input/output (–VCC) – 0.5 (+VCC) + 0.5
Differential input voltage (IN+ – IN–) ±8
Current Continuous input current (IN+, IN–, VMID_IN, VIN+, VIN–)(2) ±10 mA
Continuous output current(2) ±30
Temperature Operating, TA –55 105 °C
Junction, TJ –45 150
Storage, Tstg –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Long-term continuous current for electromigration limits.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
+VCC Positive supply voltage 4 6 7.9 V
–VCC Negative supply voltage –4 –6 –7.9 V
TA Operating free-air temperature –40 25 85 °C

7.4 Thermal Information

THERMAL METRIC(1) THS3217 UNIT
RGV (VQFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 45 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 45 °C/W
RθJB Junction-to-board thermal resistance 22 °C/W
ψJT Junction-to-top characterization parameter 1 °C/W
ψJB Junction-to-board characterization parameter 22 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4 °C/W
(1) Thermal impedance reported with backside thermal pad soldered to heat spreading plane. For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics: D2S

at +VCC = 6.0 V, –VCC = –6.0 V, AV = 2 V/V, 25-Ω source impedance, input common-mode voltage (VIC) = 0.25 V, external OPS input selected (PATHSEL ≥ 1.3 V), VREF = GND, RLOAD = 100 Ω, and TJ ≈ 25˚C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TEST LEVEL (1)
AC PERFORMANCE (Power Stage Disabled: DISABLE pin ≥ 1.3 V) (5)
Small-signal bandwidth (SSBW) VOUT = 250 mVPP, peaking < 1.0 dB 800 MHz C
Large-signal bandwidth (LSBW) VOUT = 2 VPP 500 MHz C
Bandwidth for 0.2-dB flatness VOUT = 2 VPP 250 MHz C
Slew rate(2) VOUT = 4-V step 2500 V/µs C
Over- and undershoot Input tr = 1 ns, VOUT = 2-V step 6% C
Rise and fall time Input tr = 1 ns, VOUT = 2-V step 1.2 ns C
Settling time to 0.1% Input tr = 1 ns, VOUT = 2-V step 5 ns C
2nd-order harmonic distortion (HD2) f = 20 MHz, VOUT= 2 VPP –68 dBc C
3rd-order harmonic distortion (HD3) f = 20 MHz, VOUT= 2 VPP –86 dBc C
Output voltage noise f > 200 kHz 18 nV/√Hz C
Input current noise (each input) f > 200 kHz 2.0 pA/√Hz C
Output impedance f = 20 MHz 0.8 Ω C
DC PERFORMANCE (5)
Differential to single-ended gain ±100-mV output 1.975 2.0 2.025 V/V A
Differential to single-ended gain drift TJ = –40°C to +125°C –20 –24 ppm/°C B
VREF input pin gain Differential inputs = 0 V,
VREF = ±100 mV		 0.985 1.0 1.015 V/V A
VREF input pin gain drift TJ = –40°C to +125°C –70 –95 ppm/°C B
Output offset voltage TJ = 25°C –35 ±8 35 mV A
TJ = 0°C to 70°C –43 40 mV B
TJ = –40°C to +125°C –54 47 mV B
Output offset voltage drift TJ = –40°C to +125°C -40 –115 –190 µV/°C B
Input bias current – each input(3) TJ = 25°C –4 ±2 4 µA A
TJ = 0°C to 70°C –4.2 4.2 µA B
TJ = –40°C to +125°C –4.3 4.5 µA B
Input bias current drift TJ = –40°C to +125°C 1 3 5 nA/°C B
Input offset current TJ = 25°C –400 ±50 400 nA A
TJ = 0°C to 70°C –700 940 nA B
TJ = –40°C to +125°C –1180 1600 nA B
Input offset current drift TJ = –40°C to +125°C –12 ±1 12 nA/°C B
INPUTS(4)
Common-mode input negative supply headroom TJ = 25°C 1.8 1.9 V A
TJ = –40°C to +85°C 2.0 V B
Common-mode input positive supply headroom TJ = 25°C 1.3 1.4 V A
TJ = –40°C to +125°C 1.5 V B
Common-mode rejection ratio (CMRR) –1 V ≤ VIC ≤ 3 V 47 55 dB A
Input impedance differential mode VCM = 0 V 50 || 2.4 kΩ || pF C
Input impedance common mode VCM = 0 V 90 || 2.4 kΩ || pF C
OUTPUT(6)
Output voltage headroom to either supply TJ = 25°C 1.1 1.35 1.55 V A
TJ = –40°C to +125°C V B
Output current drive TJ = 25°C, ±1.16 VPP, RLOAD = 20 Ω 50 70 mA A
DC Output Impedance Load current = ±20 mA 0.2 0.45 Ω A
POWER SUPPLY (D2S Stage + Midsupply Buffer Only; Output Power Stage Disabled: DISABLE pin ≥ 1.3 V)
Bipolar-supply operating range ±4.0 ±6.0 ±7.9 V A
Single-supply operating range 8 12 15.8 V B
Supply current ±6-V supplies 31 34 36 mA A
Supply current temperature coefficient 7 µA/°C C
(1) Test levels (all values set by characterization and simulation): (A) 100% tested at TA≈ TJ≈ 25°C; over temperature limits by characterization and simulation. (B) Not tested in production; limits set by characterization and simulation. (C) Typical value only for information. DC limits tested with no self-heating. Add internal self heating to TA for TJ.
(2) This slew rate is the average of the rising and falling time estimated from the large-signal bandwidth as: (Vpeak / √2) × 2π × f–3dB.
(3) Currents out of pin treated as a positive polarity.
(4) Applies to input pins 2 (IN+) and 3 (IN–).
(5) Output measured at pin 6.
(6) Output measured at pin 6.

7.6 Electrical Characteristics: OPS

at +VCC = 6.0 V, –VCC = –6.0 V, 25-Ω D2S source impedance, D2S input common-mode voltage (VIC) = 0.25 V, VREF = GND, RF = 249 Ω(1), RG = 162 Ω, AV = 2.5 V/V, OPS RLOAD = 100 Ω, OPS enabled (DISABLE ≤ 0.7 V or floated), external OPS input selected (PATHSEL ≥ 1.3 V), and TJ ≈ 25˚C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TEST LEVEL (2)
AC PERFORMANCE (4)
Small-signal bandwidth (SSBW) VOUT = 100 mVPP, peaking < 1.0 dB 950 MHz C
Large-signal bandwidth (LSBW) VOUT = 5 VPP 500 MHz C
Bandwidth for 0.2-dB flatness VOUT = 5 VPP 110 MHz C
Slew rate(3) VOUT = 5-V step 5500 V/µs C
Over- and undershoot Input tr = 1 ns, VOUT = 5-V step 8% C
Rise and fall time Input tr = 1 ns, VOUT = 5-V step 1.1 ns C
Settling time to 0.1% Input tr = 1 ns, VOUT = 5-V step 5 ns C
2nd-order harmonic distortion (HD2) f = 20 MHz, VOUT= 5 VPP –69 dBc C
3rd-order harmonic distortion (HD3) f = 20 MHz, VOUT= 5 VPP –73 dBc C
Noninverting input voltage noise f > 200 kHz 3.2 nV/√Hz C
Noninverting input current noise f > 200 kHz 2.8 pA/√Hz C
Inverting input current noise f > 200 kHz 30 pA/√Hz C
Closed-loop ac output impedance f = 20 MHz 0.40 Ω C
DC PERFORMANCE (4)
Open-loop transimpedance gain(1) VOUT = ±1 V, RLOAD= 500-Ω 600 1200 kΩ A
Closed-loop gain 0.1% external RF and RG resistors 2.495 2.515 2.53 V/V A
INPUT
External input offset voltage (pin 9 to pin12) TJ = 25°C –12 ±2.5 12 mV A
TJ = 0°C to 70°C –20 17 mV B
TJ = –40°C to +125°C –31 24 mV B
External input offset voltage drift (pin 9 to pin12) TJ = –40°C to +125°C -45 –115 –190 µV/°C B
Internal input offset voltage (pin 6 to pin 12) TJ = 25°C –12 ±2.5 12 mV A
TJ = 0°C to 70°C –23 18 mV B
TJ = –40°C to +125°C –35 27 mV B
Internal input offset voltage drift (pin 6 to pin 12) TJ = –40°C to +125°C –70 –150 –235 µV/°C B
External to internal input offset voltage match TJ = 25°C ±1.2 mV C
External noninverting input bias current (pin 9)(5) TJ = 25°C –5 ±5 15 µA A
TJ = 0°C to 70°C –5.2 15.4 µA B
TJ = –40°C to +125°C –5.6 15.9 µA B
External noninverting input bias current drift (pin 9) TJ = –40°C to +125°C –3 3 9 nA/°C B
Inverting input bias current – either input selected(5) TJ = 25°C –40 ±5 40 µA A
TJ = 0°C to 70°C –51 46 µA B
TJ = –40°C to +125°C –65 56 µA B
Inverting input bias current drift TJ = –40°C to +125°C –250 –120 –10 nA/°C B
Input headroom to either supply TJ = 25°C 2.6 3.0 V A
Common-mode rejection ratio (CMRR) 47 49 dB A
Noninverting input resistance 17.6 18.5 22.4 kΩ A
Noninverting input capacitance 3.3 pF C
Open-loop inverting input impedance 42 Ω C
OUTPUT(6)
Output voltage headroom to either supply RLOAD = 500 Ω 1.1 1.3 1.4 V A
Linear output current TJ = 25°C, ±2.5 V into 26-Ω RLOAD 95 120 mA A
Peak output current 0-V output, RLOAD < 0.2 Ω 135 170 mA A
DC output impedance 0-V output, load current = ±40 mA 0.05 0.10 Ω A
Internal RF 17.6 18.5 22.4 kΩ A
PATHSEL (Pin 4; Logic Reference = Pin 7 = GND)
Input low logic level Internal path selected 0.7 0.9 V A
Input high logic level External input selected at VIN (pin 9) 0.9 1.3 V A
Input voltage range –0.5 +VCC V A
PATHSEL voltage when floated Internal input from D2S selected 0 20 40 mV A
Input pin bias current(7) 0-V input 0 4 µA A
3.3-V input –150 –250 µA A
Input pin impedance 18 || 1.5 kΩ || pF C
Switching time To 1% of final value 80 ns C
Input switching glitch Both inputs at GND 50 mV C
Deselected input dc isolation ± 2-V input 70 80 dB A
Deselected input ac isolation 2 VPP, at 20-MHz input 55 65 dB C
DISABLE (Pin 10; Logic Reference = Pin 7 = GND)
Input low logic level 0.7 0.9 V A
Input high logic level 0.9 1.3 V A
Shutdown control voltage range –0.5 +VCC V B
Shutdown voltage when floated Output stage enabled 0 20 40 mV A
Input pin bias current(7) 0-V input 0 4 µA A
3.3-V input –150 –250 µA A
Input pin impedance 18 || 1.5 kΩ || pF C
Switching time (turn on or off) To 10% of final value 200 ns C
Shutdown dc isolation (either input) ±2-V input 70 80 dB A
Shutdown ac isolation (either input) 2 VPP at 20-MHz input 55 65 dB C
POWER SUPPLY
Bipolar-supply operating range ±4.0 ±6.0 ±7.9 V A
Single-supply operating range 8 12 15.8 V B
Supply current (OPS only) ±6-V supplies 18.5 21 24.5 mA A
Disabled supply current in OPS ±6-V supplies 2.0 2.4 3.0 mA C
Logic reference current at pin 7(7) Pins 4, 7, and 10 held at 0 V 200 280 380 µA A
(1) Output power stage includes an internal 18.5-kΩ feedback resistor. This internal resistor, in parallel with an external 249-Ω RF and 162-Ω RG, results in a gain of 2.5 V/V after including a nominal gain loss of 0.9935 V/V due to the input buffer and loop-gain effects.
(2) Test levels (all values set by characterization and simulation): (A) 100% tested at TA≈ TJ≈ 25°C; over temperature limits by characterization and simulation. (B) Not tested in production; limits set by characterization and simulation. (C) Typical value only for information. DC limits tested with no self-heating. Add internal self heating to TA for TJ.
(3) This slew rate is the average of the rising and falling time estimated from the large-signal bandwidth as: (Vpeak / √2) × 2π × f–3dB.
(4) Output measured at pin 11.
(5) Currents out of pin treated as a positive polarity.
(6) Output measured at pin 11.
(7) Currents out of pin treated as a positive polarity.

7.7 Electrical Characteristics: D2S + OPS

at +VCC = 6.0 V, –VCC = –6.0 V, 25-Ω D2S source impedance, D2S input VIC = 0.25 V, Internal path selected to OPS (PATHSEL ≤ 0.7 V or floated), VREF = GND, combined AV = 5 V/V, D2S RLOAD= 200 Ω, RF = 249 Ω(1), RG = 162 Ω (OPS AV = 2.5 V/V), OPS enabled (DISABLE ≤ 0.7 V or floated), OPS RLOAD = 100 Ω, and TJ ≈ 25˚C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TEST LEVEL (2)
AC PERFORMANCE(4)
Small-signal bandwidth (SSBW) VOUT = 100 mVPP, peaking < 1.5 dB 800 MHz C
Large-signal bandwidth (LSBW) VOUT = 5 VPP 500 MHz C
Bandwidth for 0.2-dB flatness VOUT = 2 VPP 100 MHz C
Slew rate(3) VOUT = 8-V step 5000 V/µs C
Over- and undershoot Input tr = 1 ns, VOUT = 5-V step 8% C
Rise and fall time Input tr = 1 ns, VOUT = 5-V step 1.1 ns C
Settling time to 0.1% Input tr = 1 ns, VOUT = 5-V step 7 ns C
2nd-order harmonic distortion (HD2) f = 20 MHz, VOUT= 5 VPP –60 dBc C
3rd-order harmonic distortion (HD3) f = 20 MHz, VOUT= 5 VPP –75 dBc C
Output voltage noise f > 200 kHz 45 nV/√Hz C
DC PERFORMANCE(4)
Total gain D2S to OPS output(1) 0.1% tolerance, dc, ±100-mV output test 4.92 5.02 5.12 V/V A
POWER SUPPLY (Combined D2S, OPS, and Midscale Reference Buffer)
Bipolar-supply operating range ±4.0 ±6.0 ±7.9 V A
Single-supply operating range 8 12 15.8 V B
Supply current ±6-V supplies 51 54 57 mA A
Supply current temperature coefficient 10 µA/°C C
(1) Output power stage includes an internal 18.5-kΩ feedback resistor. This internal resistor, in parallel with an external 249-Ω RF and 162-Ω RG, results in a gain of 2.5 V/V after including a nominal gain loss of 0.9935 V/V due to the input buffer and loop-gain effects.
(2) Test levels (all values set by characterization and simulation): (A) 100% tested at TA≈ TJ≈ 25°C; over temperature limits by characterization and simulation. (B) Not tested in production; limits set by characterization and simulation. (C) Typical value only for information.
(3) This slew rate is the average of the rising and falling time estimated from the large-signal bandwidth as: (Vpeak / √2) × 2π × f–3dB.
(4) Output measured at pin 11.

7.8 Electrical Characteristics: Midscale (DC) Reference Buffer

at +VCC = 6.0 V, –VCC = –6.0 V, RLOAD = 150 Ω at pin 15, and TJ ≈ 25˚C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TEST LEVEL (1)
AC PERFORMANCE (Output measured at pin 15)
Small-signal bandwidth (SSBW) VOUT = 100 mVPP 400 MHz C
Large-signal bandwidth (LSBW) VOUT = 1 VPP 110 MHz C
Slew rate(2) VOUT = 4-V step 250 V/µs C
Input voltage noise f > 200 kHz 4.4 nV/√Hz C
Input current noise f > 200 kHz 2.3 pA/√Hz C
AC output impedance f = 20 MHz 1.0 Ω C
DC AND I/O PERFORMANCE (RS = 25 Ω, and output measured at pin 15, unless otherwise noted)
Buffer gain VI = ±1 V, RLOAD = 200 Ω .9985 0.999 1.001 V/V A
Buffer gain drift TJ = –40°C to +125°C –1.5 –2.0 ppm/°C B
Output offset from midsupply Input floating, pin 1 open –120 30 70 mV A
Output offset voltage TJ = 25°C, input driven to 0 V from 0-Ω source –1.0 4.0 15 mV A
Input offset voltage drift TJ = –40°C to +125°C, input driven to 0 V –4 3 10 µV/°C B
Input bias current(3) TJ = 25°C –15 ±1 15 µA A
Input bias current drift TJ = –40°C to +125°C –8 –2 3 nA/°C B
Input/output headroom to either supply TJ = 25°C, gain change < 1% 1.1 1.4 V A
Input impedance Internal 50-kΩ divider resistors to each supply 22 || 1.5 kΩ || pF C
Linear output current into resistive load ±2.25 V into 36 Ω 40 65 mA A
DC output impedance Load current = ±30 mA 0.21 Ω C
(1) Test levels (all values set by characterization and simulation): (A) 100% tested at TA≈ TJ≈ 25°C; over temperature limits by characterization and simulation. (B) Not tested in production; limits set by characterization and simulation. (C) Typical value only for information.
(2) This slew rate is the average of the rising and falling time estimated from the large-signal bandwidth as: (VPEAK / √2) × 2π × f–3dB.
(3) Currents out of pin treated as a positive polarity.

7.9 Typical Characteristics: D2S + OPS

at +VCC = 6 V, –VCC = –6 V, 25-Ω D2S source impedance , VIC = 0.25 V, Internal path selected (PATHSEL = GND), VREF = GND, D2S RLOAD = 200 Ω at pin 6, RF = 249 Ω, RG = 162 Ω, OPS AV = 2.5 V/V, OPS On (DISABLE = GND), and OPS RLOAD = 100 Ω at pin 11 (unless otherwise noted)
THS3217 D001_SBOS766.gif
Figure 1. Frequency Response vs Output Voltage
THS3217 D003_SBOS766.gif
Figure 3. HD2 vs Frequency
THS3217 D005_SBOS766.gif
26 units shown
Figure 5. Gain vs Temperature
THS3217 D007_SBOS766.gif
VOUT = 500 mVPP, see Table 2
Figure 7. Small-Signal Frequency Response vs Gain
THS3217 D009_SBOS766.gif
VOUT = 5 VPP
Figure 9. HD2 vs Gain
THS3217 D011_SBOS766.gif
Test frequency = 20 MHz
Figure 11. HD2 vs Supply Voltage
THS3217 D002_SBOS766.gif
Figure 2. Small and Large Signal Step Response
THS3217 D004_SBOS766.gif
Figure 4. HD3 vs Frequency
THS3217 D006_SBOS766.gif
25-Ω source impedance on each D2S input
Figure 6. Input Referred Differential Noise
THS3217 D008_SBOS766.gif
VOUT = 5 VPP, see Table 2
Figure 8. Large-Signal Frequency Response vs Gain
THS3217 D010_SBOS766.gif
VOUT = 5 VPP
Figure 10. HD3 vs Gain
THS3217 D012_SBOS766.gif
Test frequency = 20 MHz
Figure 12. HD3 vs Supply Voltage

7.10 Typical Characteristics: D2S Only

at +VCC = 6.0 V, –VCC = –6.0 V, fixed gain of 2 V/V, 25-Ω D2S source impedance, VIC = 0.25 V, external path selected (PATHSEL = +VCC), VREF = GND, and D2S RLOAD = 100 Ω at pin 6 (unless otherwise noted)
THS3217 D013_SBOS766.gif
VOUT = 250 mVPP
Figure 13. Frequency Response vs Input Common-Mode Voltage
THS3217 D015_SBOS766.gif
RLOAD = 200 Ω
Figure 15. HD2 vs Output Voltage
THS3217 D017_SBOS766.gif
Figure 17. Common-Mode Rejection Ratio vs Input Common-Mode Voltage
THS3217 D019_SBOS766.gif
30 units shown
Figure 19. Output DC Offset Voltage vs Die Temperature
THS3217 D021_SBOS766.gif
±1-V output pulse
Figure 21. Large-Signal Step Response vs Load Resistance
THS3217 D023_SBOS766.gif
25-Ω D2S source impedance on each input
Figure 23. VREF Input Pin Frequency Response
THS3217 D014_SBOS766.gif
VOUT = 2 VPP
Figure 14. Frequency Response vs Load Resistance
THS3217 D016_SBOS766.gif
RLOAD = 200 Ω
Figure 16. HD3 vs Output Voltage
THS3217 D018_SBOS766.gif
Figure 18. Differential Input Noise vs Source Impedance
THS3217 D020_SBOS766.gif
Figure 20. Output Impedance vs Supply Voltage
THS3217 D022_SBOS766.gif
±1-V output pulse
Figure 22. Large-Signal Pulse Settling Response vs Load Resistance
THS3217 D024_SBOS766.gif
Figure 24. Simulated Power-Supply Rejection Ratio vs Input Common-Mode Voltage

7.11 Typical Characteristics: OPS only

at +VCC = 6.0 V, –VCC = –6.0 V, 25-Ω D2S source impedance, VREF = GND, RF = 249 Ω, RG = 162 Ω, OPS AV = 2.5V/V, OPS RLOAD = 100 Ω at pin 11, OPS enabled (DISABLE = GND), and external input path selected (PATHSEL = +VCC) (unless otherwise noted)
THS3217 D025_SBOS766.gif
VOUT = 100 mVPP, see Table 2 for RF values vs gain
Figure 25. Frequency Response vs Noninverting Gain
THS3217 D027_SBOS766.gif
Figure 27. Noninverting Response vs Output Voltage
THS3217 D029_SBOS766.gif
Figure 29. Noninverting Step Response
THS3217 D031_SBOS766.gif
Figure 31. HD2 vs Output Voltage
THS3217 D033_SBOS766.gif
VOUT = 5 VPP
Figure 33. HD2 vs Load Resistance
THS3217 D035_SBOS766.gif
VOUT = 5 VPP
Figure 35. HD2 vs Supply Voltage
THS3217 D037_SBOS766.gif
±100-kHz tone separation, output voltage for each tone
Figure 37. IMD2 vs Output Voltage
THS3217 D039_SBOS766.gif
Figure 39. Input-Referred Spot Noise vs Frequency
THS3217 D041_SBOS766.gif
30 units shown
Figure 41. Quiescent Supply Current vs Temperature
THS3217 D043_SBOS766.gif
See Table 7 for RF values vs OPS gain
Figure 43. Series Output Resistance vs Load Capacitance
THS3217 D045_SBOS766.gif
RF = 205 Ω, AV = 5 V/V, VOUT = 10 VPP, see Figure 43 for RS value
Figure 45. HD2 vs Load Capacitance
THS3217 D047_SBOS766.gif
CLOAD = 200 pF, RF = 205 Ω, AV = 5 V/V, see Figure 43 for RS value
Figure 47. Pulse Response
THS3217 D026_SBOS766.gif
VOUT = 100 mVPP, see Table 4 for RF values vs gain
Figure 26. Frequency Response vs Inverting Gain
THS3217 D028_SBOS766.gif
AV = –2.5 V/V, see Table 4 for RF value
Figure 28. Inverting Response vs Output Voltage
THS3217 D030_SBOS766.gif
AV = –2.5 V/V, see Table 4 for RF value
Figure 30. Inverting Step Response
THS3217 D032_SBOS766.gif
Figure 32. HD3 vs Output Voltage
THS3217 D034_SBOS766.gif
VOUT = 5 VPP
Figure 34. HD3 vs Load Resistance
THS3217 D036_SBOS766.gif
VOUT = 5 VPP
Figure 36. HD3 vs Supply Voltage
THS3217 D038_SBOS766.gif
±100-kHz tone separation, output voltage for each tone
Figure 38. IMD3 vs Output Voltage
THS3217 D040_SBOS766.gif
Output swing with better than 0.1% linearity
Figure 40. Linear Output Swing vs Load Resistance
THS3217 D042_SBOS766.gif
±4.5-V input triangular wave, OPS AV = 2.5 V/V
Figure 42. Output Overdrive Response
THS3217 D044_SBOS766.gif
VOUT = 500 mVPP, see Figure 43 for RS value
Figure 44. Frequency Response vs Load Capacitance
THS3217 D046_SBOS766.gif
RF = 205 Ω, AV = 5 V/V, VOUT = 10 VPP, see Figure 43 for RS value
Figure 46. HD3 vs Load Capacitance
THS3217 D048_SBOS766.gif
CLOAD = 300 pF, RF = 205 Ω, AV = 5 V/V, see Figure 43 for RS value.
Figure 48. Pulse Response

7.12 Typical Characteristics: Midscale (DC) Reference Buffer

at +VCC = 6.0 V, –VCC = –6.0 V, RLOAD = 150 Ω, and TA ≈ 25˚C (unless otherwise noted)
THS3217 D049_SBOS766.gif
Figure 49. Frequency Response vs Output Voltage
THS3217 D051_SBOS766.gif
Figure 51. Buffer Output Impedance vs Load Current
THS3217 D053_SBOS766.gif
RLOAD = 150 Ω in parallel with CLOAD, see the Midscale Buffer ROUT Versus CLOAD Measurement section for circuit setup
Figure 53. Series Output Resistance vs Capacitive Load
THS3217 D050_SBOS766.gif
Figure 50. Step Response
THS3217 D052_SBOS766.gif
Figure 52. Buffer Output Offset vs Load Current (ILOAD)
THS3217 D054_SBOS766.gif
VOUT = 100 mVPP, RLOAD = 150 Ω in parallel with CLOAD, see Midscale Buffer ROUT Versus CLOAD Measurement for circuit setup
Figure 54. Frequency Response vs Capacitive Load

7.13 Typical Characteristics: Switching Performance

at +VCC = 6 V, –VCC = –6 V, 25-Ω D2S source impedance , VIC = 0.25 V, Internal path selected (PATHSEL = GND), VREF = GND, D2S RLOAD = 200 Ω at pin 6, RF = 249 Ω, RG = 162 Ω, OPS On (DISABLE = GND), and OPS RLOAD = 100 Ω at pin 11 (unless otherwise noted)
THS3217 D055_SBOS766.gif
D2S Inputs: IN+ = IN– = GND, OPS input: VIN+ = 1 V
Figure 55. PATHSEL Switching Time
THS3217 D057_SBOS766.gif
Figure 57. OPS Forward Feedthrough in Disable
THS3217 D059_SBOS766.gif
D2S inputs: IN+ = IN– = GND, OPS input: VIN+ = 1 V
Figure 59. PATHSEL Switching Threshold vs Power Supply
THS3217 D056_SBOS766.gif
PATHSEL = high, OPS input: VIN+ = 1 VPP , 10-MHz sine wave
Figure 56. OPS Enable and Disable Time
THS3217 D058_SBOS766.gif
Figure 58. OPS Reverse Feedthrough in Disable
THS3217 D060_SBOS766.gif
PATHSEL = high, OPS input: VIN+ = 1 V
Figure 60. OPS Shutdown Threshold vs Power Supply

7.14 Typical Characteristics: Miscellaneous Performance

at +VCC = 6 V, –VCC = –6 V, 50-Ω D2S source impedance , VIC = 0.25 V, internal path selected (PATHSEL = GND), VREF = GND, D2S RLOAD = 100 Ω at pin 6, RF = 249 Ω, RG = 162 Ω, OPS on (DISABLE = GND), and OPS RLOAD = 100 Ω at pin 11 (unless otherwise noted)
THS3217 D061_SBOS766.gif
30 units shown
Figure 61. D2S Gain Over Temperature
THS3217 D063_SBOS766.gif
29 units shown
Figure 63. OPS Gain Over Temperature
THS3217 D065_SBOS766.gif
30 units shown
Figure 65. Midscale Buffer Gain Over Temperature
THS3217 D062_SBOS766.gif
30 units from –40°C to +125°C
Figure 62. D2S Gain Drift Histogram
THS3217 D064_SBOS766.gif
29 units from –40°C to +125°C
Figure 64. OPS Gain Drift Histogram
THS3217 D066_SBOS766.gif
30 units from –40°C to +125°C
Figure 66. Midscale Buffer Gain Drift Histograms