SBOS875C August   2017  – February 2023 THS3491

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Bare Die Information
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics: VS = ±15 V
    6. 8.6 Electrical Characteristics: VS = ±7.5 V
    7. 8.7 Typical Characteristics: ±15 V
    8. 8.8 Typical Characteristics: ±7.5 V
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Power-Down (PD) Pin
      2. 9.3.2 Power-Down Reference (REF) Pin
      3. 9.3.3 Internal Junction Temperature Sense (TJ_SENSE) Pin
    4. 9.4 Device Functional Modes
      1. 9.4.1 Wideband Noninverting Operation
      2. 9.4.2 Wideband, Inverting Operation
      3. 9.4.3 Single-Supply Operation
      4. 9.4.4 Maximum Recommended Output Voltage
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Driving Capacitive Loads
      2. 10.1.2 Video Distribution
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
        1. 10.4.1.1 PowerPAD™ Integrated Circuit Package Design Considerations (DDA Package Only)
          1. 10.4.1.1.1 PowerPAD™ Integrated Circuit Package Layout Considerations
          2. 10.4.1.1.2 Power Dissipation and Thermal Considerations
      2. 10.4.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.7 Typical Characteristics: ±15 V

at +VS = 15 V, –VS = –15 V, TA ≅ 25°C, RLOAD = 100 Ω to midsupply, noninverting gain (G) = 5 V/V. RGT package : RF = 576 Ω, RG = 143 Ω, or DDA package: RF = 798 Ω, RG = 200 Ω (unless otherwise noted)

GUID-0CBF8DFC-1381-4067-820B-D0CDB60592F2-low.gif
VO = 2 VPPRGT package
Figure 8-1 Noninverting Small-Signal Frequency Response
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VO = 2 VPP
Figure 8-3 Inverting Small-Signal Frequency Response
GUID-76751227-1E3F-44AC-BF36-B3F099785C4E-low.gifFigure 8-5 Frequency Response vs CLOAD
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DDA package
Figure 8-7 HD2 vs Frequency
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VO = 2 VPPRGT package
Figure 8-9 HD2 vs Frequency
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Figure 8-11 HD2 vs Frequency Across Output Swing
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Figure 8-13 HD2 vs Output Swing
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VO = 2 VPP
Figure 8-15 HD2 vs Frequency Across Temperature
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VO = 2 VPPRLoad = 1 kΩ
Figure 8-17 Harmonic Distortion vs Frequency
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±100-kHz frequency spacing
Figure 8-19 IMD2 vs Output Voltage Swing
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Figure 8-21 Spot Input Noise vs Frequency
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VO = 10 VPP
Figure 8-23 G = 5 V/V Pulse Response
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VO = 10 VPP
Figure 8-25 G = –5 V/V Pulse Response
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Figure 8-27 Output Impedance vs Frequency
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VIN = 2 VPP
Figure 8-29 Shutdown Feedthrough vs Frequency
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A. Measured with devices soldered on TI EVM. Devices not turned off at any read points but load applied for a few milliseconds to measure VOUT and then removed.
Figure 8-31 Output Voltage Swing vs Output Current
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7100 units at each supply
Figure 8-33 Inverting IB Distribution
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Flash tested to keep TJ as close to TA as possible
Figure 8-35 Input Offset Voltage Over Temperature
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Flash tested to keep TJ as close to TA as possible
Figure 8-37 Noninverting IB Over Temperature
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90 units at each supply
Figure 8-39 Inverting IB Drift Histogram
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Device in shutdown mode to minimize self-heating, RGT package
Figure 8-41 TJ_SENSE Voltage vs Ambient Temperature
GUID-02F3A63C-021A-423F-A5F1-4448D11ABE21-low.gif
VO = 2 VPPDDA package
Figure 8-2 Noninverting Small-Signal Frequency Response
GUID-AC5E4392-70C5-45B9-AF81-07DEB3E328AA-low.gifFigure 8-4 Frequency Response vs Output Swing
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VO = 2 VPPRGT package
Figure 8-6 Frequency Response vs Temperature
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DDA package
Figure 8-8 HD3 vs Frequency
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VO = 2 VPPRGT package
Figure 8-10 HD3 vs Frequency
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Figure 8-12 HD3 vs Frequency Across Output Swing
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Figure 8-14 HD3 vs Output Swing
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VO = 2 VPP
Figure 8-16 HD3 vs Frequency Across Temperature
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VO = 5 VPP per tone±100-kHz frequency spacing
Figure 8-18 Intermodulation Distortion vs Frequency
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±100-kHz frequency spacing
Figure 8-20 IMD3 vs Output Voltage Swing
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No load
Figure 8-22 Open-Loop Transimpedance Gain and Phase vs Frequency
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VO = 20 VPP
Figure 8-24 G = 5 V/V Pulse Response
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VO = 20 VPP
Figure 8-26 G = –5 V/V Pulse Response
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Figure 8-28 Overdrive Recovery Time
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Figure 8-30 Quiescent Current vs Supply Voltage
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7100 units at each supply
Figure 8-32 Input Offset Voltage Distribution
GUID-7402D8DB-52F3-4829-83D8-5F8E3E3010CC-low.gif
7100 units at each supply
Figure 8-34 Noninverting IB Distribution
GUID-55866E51-4C61-4864-A60D-B59242020D84-low.gif
Flash tested to keep TJ as close to TA as possible
Figure 8-36 Inverting IB Over Temperature
GUID-EBE02540-0EAE-4D18-81EF-080788773E17-low.gif
90 units at each supply
Figure 8-38 Input Offset Voltage Drift Histogram
GUID-A78E21A6-3705-4905-A584-D34A9AF3ED7B-low.gif
90 units at each supply
Figure 8-40 Noninverting IB Drift Histogram