SBOS875C August   2017  – February 2023 THS3491

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Bare Die Information
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics: VS = ±15 V
    6. 8.6 Electrical Characteristics: VS = ±7.5 V
    7. 8.7 Typical Characteristics: ±15 V
    8. 8.8 Typical Characteristics: ±7.5 V
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Power-Down (PD) Pin
      2. 9.3.2 Power-Down Reference (REF) Pin
      3. 9.3.3 Internal Junction Temperature Sense (TJ_SENSE) Pin
    4. 9.4 Device Functional Modes
      1. 9.4.1 Wideband Noninverting Operation
      2. 9.4.2 Wideband, Inverting Operation
      3. 9.4.3 Single-Supply Operation
      4. 9.4.4 Maximum Recommended Output Voltage
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Driving Capacitive Loads
      2. 10.1.2 Video Distribution
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
        1. 10.4.1.1 PowerPAD™ Integrated Circuit Package Design Considerations (DDA Package Only)
          1. 10.4.1.1.1 PowerPAD™ Integrated Circuit Package Layout Considerations
          2. 10.4.1.1.2 Power Dissipation and Thermal Considerations
      2. 10.4.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The THS3491 current feedback amplifier (CFA) provides a new level of performance for applications requiring the lowest distortion at high output power levels from DC through values greater than 100 MHz at 100-Ω loads. Although specified at a gain of 5 V/V, this current feedback design holds near constant bandwidth and distortion over a wide range of gains.

The 8000 V/µs of slew rate delivers an output of 10 VPP into demanding loads with low distortion through 100 MHz. The 900-MHz, small-signal bandwidth delivers a low overshoot of less than 1.5% for a 10-V step, and rise and fall times of less than 1.3 ns. Peak output current drive values greater than 500 mA enable driving heavy capacitive loads with fast signals.

New designs benefit from the lowest distortion using the VQFN-16 (RGT) package, whereas the 8-pin HSOIC (DDA) package (with PowerPAD™) upgrades existing THS3091 or THS3095 designs. Lower output headroom for the THS3491 provides more output swing on the same ±15-V supplies versus legacy THS3091 or THS3095 options.

Package Information(1)(2)
PART NUMBER PACKAGE BODY SIZE (NOM)
THS3491 RGT (VQFN, 16) 3.00 mm × 3.00 mm
DDA (HSOIC, 8) 4.89 mm × 3.90 mm
Device Information
PART NUMBER PACKAGE DIE SIZE (NOM)
THS3491 Bare die 1.02 mm × 1.06 mm
(1) For all available packages, see the package option addendum at the end of the data sheet.
GUID-1B7FB283-1F10-4FFB-99D9-CA59C849C3D9-low.gifTypical Arbitrary Waveform Generator Output Drive Circuit
GUID-AF50A262-A394-478D-8AEC-DE81EACFBF10-low.gifHarmonic Distortion vs Frequency