SBOS875C August   2017  – February 2023 THS3491

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Bare Die Information
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics: VS = ±15 V
    6. 8.6 Electrical Characteristics: VS = ±7.5 V
    7. 8.7 Typical Characteristics: ±15 V
    8. 8.8 Typical Characteristics: ±7.5 V
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Power-Down (PD) Pin
      2. 9.3.2 Power-Down Reference (REF) Pin
      3. 9.3.3 Internal Junction Temperature Sense (TJ_SENSE) Pin
    4. 9.4 Device Functional Modes
      1. 9.4.1 Wideband Noninverting Operation
      2. 9.4.2 Wideband, Inverting Operation
      3. 9.4.3 Single-Supply Operation
      4. 9.4.4 Maximum Recommended Output Voltage
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Driving Capacitive Loads
      2. 10.1.2 Video Distribution
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
        1. 10.4.1.1 PowerPAD™ Integrated Circuit Package Design Considerations (DDA Package Only)
          1. 10.4.1.1.1 PowerPAD™ Integrated Circuit Package Layout Considerations
          2. 10.4.1.1.2 Power Dissipation and Thermal Considerations
      2. 10.4.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.2.3 Application Curves

GUID-B9480801-3185-42FA-9D2F-8F20149AF394-low.gif
RTOT_LOAD = 100 ΩVO (amplifier output) = 20 VPP
Figure 10-6 Frequency Response Of Two-Amplifier Configuration in GUID-2EC6AAA8-9A09-43EB-A73C-DF7ADF66BC84.html#SLOS4236684 (Gain = 5 V/V, Measured At VOUT)
GUID-FDC2DF35-5E4E-436E-8785-3CF4C33CD7F3-low.gif
RTOT_LOAD = 20 ΩVO (amplifier output) = 20 VPP
Figure 10-8 HD2 For Amplifier Load-Sharing Configuration (Gain = 5 V/V)
GUID-E103F077-D219-47C6-A033-B633FBCA96E3-low.gif
RTOT_LOAD = 100 ΩVO (amplifier output) = 20 VPP
Figure 10-7 Distortion Of Two-Amplifier Configuration in GUID-2EC6AAA8-9A09-43EB-A73C-DF7ADF66BC84.html#SLOS4236684 (Gain = 5 V/V, Measured At VOUT)
GUID-6ADC682C-1530-4F08-8D04-440C5CF36FC6-low.gif
RTOT_LOAD = 20 ΩVO (amplifier output) = 20 VPP
Figure 10-9 HD2 For Amplifier Load-Sharing Configuration (Gain = 5 V/V)