SLOS454I January   2005  – July 2016 THS4509

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS+ - VS- = 5 V
    6. 7.6 Electrical Characteristics: VS+ - VS- = 3 V
    7. 7.7 Dissipation Ratings
    8. 7.8 Typical Characteristics
      1. 7.8.1 Typical Characteristics: VS+ - VS- = 5 V
      2. 7.8.2 Typical Characteristics: VS+ - VS- = 3 V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Test Circuits
        1. 8.3.1.1 Frequency Response
        2. 8.3.1.2 Distortion and 1-dB Compression
        3. 8.3.1.3 S-Parameter, Slew Rate, Transient Response, Settling Time, Output Impedance, Overdrive, Output Voltage, Turnon, and Turnoff Time
        4. 8.3.1.4 CM Input
        5. 8.3.1.5 CMRR and PSRR
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Differential Input to Differential Output Amplifier
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Input Common-Mode Voltage Range
          2. 9.2.1.2.2 Setting the Output Common-Mode Voltage
          3. 9.2.1.2.3 Single-Supply Operation (3 V to 5 V)
          4. 9.2.1.2.4 THS4509 and ADS5500 Combined Performance
          5. 9.2.1.2.5 THS4509 and ADS5424 Combined Performance
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Single-Ended Input to Differential Output Amplifier
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 General Guidelines
      2. 11.1.2 PowerPAD PCB Layout Considerations
    2. 11.2 Layout Example
    3. 11.3 PowerPAD Design Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.