SLOS375B August   2014  – February 2024 THS4541

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: (Vs+) – Vs– = 5 V
    6. 6.6 Electrical Characteristics: (Vs+) – Vs– = 3 V
    7. 6.7 Typical Characteristics 5-V Single Supply
    8. 6.8 Typical Characteristics: 3-V Single Supply
    9. 6.9 Typical Characteristics: 3-V to 5-V Supply Range
  8. 7 Parameter Measurement Information
    1. 7.1 Example Characterization Circuits
    2. 7.2 Frequency-Response Shape Factors
    3. 7.3 I/O Headroom Considerations
    4. 7.4 Output DC Error and Drift Calculations and the Effect of Resistor Imbalances
    5. 7.5 Noise Analysis
    6. 7.6 Factors Influencing Harmonic Distortion
    7. 7.7 Driving Capacitive Loads
    8. 7.8 Thermal Analysis
  9. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Terminology and Application Assumptions
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Differential I/O
      2. 8.3.2 Power-Down Control Pin (PD)
        1. 8.3.2.1 Operating the Power Shutdown Feature
      3. 8.3.3 Input Overdrive Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation from Single-Ended Sources to Differential Outputs
        1. 8.4.1.1 AC-Coupled Signal Path Considerations for Single-Ended Input to Differential Output Conversion
        2. 8.4.1.2 DC-Coupled Input Signal Path Considerations for Single-Ended to Differential Conversion
        3. 8.4.1.3 Resistor Design Equations for the Single-Ended to Differential Configuration of the FDA
        4. 8.4.1.4 Input Impedance for the Single-Ended to Differential FDA Configuration
      2. 8.4.2 Differential-Input to Differential-Output Operation
        1. 8.4.2.1 AC-Coupled, Differential-Input to Differential-Output Design Issues
        2. 8.4.2.2 DC-Coupled, Differential-Input to Differential-Output Design Issues
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Designing Attenuators
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Interfacing to High-Performance ADCs
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 TINA Simulation Model Features
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RUN|10
  • RGT|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)THS4541UNIT
RGT (VQFN)RUN (WQFN)
16 PINS10 PINS
RθJAJunction-to-ambient thermal resistance52146°C/W
RθJC(top)Junction-to-case (top) thermal resistance6975°C/W
RθJBJunction-to-board thermal resistance2539°C/W
ψJTJunction-to-top characterization parameter2.714°C/W
ψJBJunction-to-board characterization parameter25105°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance9.347°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.