SBOS831B December   2016  – June 2021 THS4552

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: (VS+) – (VS–) = 5 V
    6. 6.6 Electrical Characteristics: (VS+) – (VS–) = 3 V
    7. 6.7 Typical Characteristics: (VS+) – (VS–) = 5 V
    8. 6.8 Typical Characteristics: (VS+) – (VS–) = 3 V
    9. 6.9 Typical Characteristics: 3 V to 5 V Supply Range
  7. Parameter Measurement Information
    1. 7.1 Example Characterization Circuits
    2. 7.2 Output Interface Circuit for DC-Coupled Differential Testing
    3. 7.3 Output Common-Mode Measurements
    4. 7.4 Differential Amplifier Noise Measurements
    5. 7.5 Balanced Split-Supply Versus Single-Supply Characterization
    6. 7.6 Simulated Characterization Curves
    7. 7.7 Terminology and Application Assumptions
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Differential Open-Loop Gain and Output Impedance
      2. 8.3.2 Setting Resistor Values Versus Gain
      3. 8.3.3 I/O Headroom Considerations
      4. 8.3.4 Output DC Error and Drift Calculations and the Effect of Resistor Imbalances
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation from Single-Ended Sources to Differential Outputs
        1. 8.4.1.1 AC-Coupled Signal Path Considerations for Single-Ended Input to Differential Output Conversions
        2. 8.4.1.2 DC-Coupled Input Signal Path Considerations for Single-Ended to Differential Conversions
      2. 8.4.2 Operation from a Differential Input to a Differential Output
        1. 8.4.2.1 AC-Coupled, Differential-Input to Differential-Output Design Issues
        2. 8.4.2.2 DC-Coupled, Differential-Input to Differential-Output Design Issues
      3. 8.4.3 Input Overdrive Performance
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Noise Analysis
      2. 9.1.2 Factors Influencing Harmonic Distortion
      3. 9.1.3 Driving Capacitive Loads
      4. 9.1.4 Interfacing to High-Performance Precision ADCs
      5. 9.1.5 Operating the Power Shutdown Feature
      6. 9.1.6 Channel-to-Channel Crosstalk
      7. 9.1.7 Channel-to-Channel Mismatch
      8. 9.1.8 Designing Attenuators
      9. 9.1.9 The Effect of Adding a Feedback Capacitor
    2. 9.2 Typical Applications
      1. 9.2.1 An MFB Filter Driving an ADC Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Differential Transimpedance Output to a High-Grade Audio PCM DAC Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 ADC3k Driver with a 2nd-Order RLC Interstage Filter Application
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Thermal Analysis
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Board Layout Recommendations
    2. 11.2 Layout Example
    3. 11.3 EVM Board
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 TINA-TI Simulation Model Features
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Driving Capacitive Loads

The capacitive load of an ADC or some other next-stage device is commonly required to be driven. Directly connecting a capacitive load to the output pins of a closed-loop amplifier such as the THS4552 can lead to an unstable response; see the step response plots into a capacitive load (Figure 6-8, Figure 6-10, Figure 6-26, and Figure 6-28). One typical remedy to this instability is to add two small series resistors (RO) at the outputs of the THS4552 before the capacitive load. Figure 6-6 and Figure 6-24 illustrate parametric plots of recommended RO values versus differential capacitor load values and gains. Operating at higher noise gains requires lower RO values to obtain a ±0.5 dB flat response for the same capacitive load. Some direct parasitic loading is acceptable without a series RO that increases with gain setting (see Fgiure 6-8, Figure 6-10, Figure 6-26, and Figure 6-28 where the RO value is 0 Ω). Even when these plots suggest that a series RO is not required, good practice is to leave a place for the RO elements in a board layout (a 0 Ω value initially) for later adjustment in case the response appears unacceptable.

The rail-to-rail output stage of the THS4552 has an inductive characteristic in the open-loop output impedance at higher frequencies; see Figure 6-68. This inductive open-loop output impedance introduces added phase shift at the output pins for direct capacitive loads and feedback capacitors. Larger values of feedback capacitors (greater than 100 pF) can risk a low phase margin. Including a 10 Ω to 15 Ω series resistor with a feedback capacitor can be used to reduce this effect.

The TINA-TI™ simulation model does a good job of predicting these issues and illustrating the effect for different choices of capacitive load isolating resistors (RO) and different feedback capacitor configurations.