SBOS874D August   2017  – February 2021 THS4561

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS+ – VS– = 5 V to 12 V
    6. 7.6 Typical Characteristics: (VS+) – (VS–) = 12 V
    7. 7.7 Typical Characteristics: (VS+) – (VS–) = 5 V
    8. 7.8 Typical Characteristics: (VS+) – (VS–) = 3 V
    9. 7.9 Typical Characteristics: (VS+) – (VS–) = 3-V to 12-V Supply Range
  8. 8 Parameter Measurement Information
    1. 8.1 Example Characterization Circuits
    2. 8.2 Output Interface Circuit for DC-Coupled Differential Testing
    3. 8.3 Output Common-Mode Measurements
    4. 8.4 Differential Amplifier Noise Measurements
    5. 8.5 Balanced Split-Supply Versus Single-Supply Characterization
    6. 8.6 Simulated Characterization Curves
    7. 8.7 Terminology and Application Assumptions
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Down Mode
      2. 9.4.2 Single-Ended Source to Differential Output Mode
        1. 9.4.2.1 AC-Coupled Signal Path Considerations for Single-Ended Input to Differential Output Conversions
        2. 9.4.2.2 DC-Coupled Input Signal Path Considerations for Single-Ended to Differential Conversions
      3. 9.4.3 Differential Input to a Differential Output Mode
        1. 9.4.3.1 AC-Coupled, Differential-Input to Differential-Output Design Issues
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Differential Open-Loop Gain and Output Impedance
      2. 10.1.2 Setting Resistor Values Versus Gain
      3. 10.1.3 Noise Analysis
      4. 10.1.4 Factors Influencing Harmonic Distortion
      5. 10.1.5 Input Overdrive Performance
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Board Layout Recommendations
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (December 2020) to Revision D (February 2021)

  • Changed the status of the RGT package from preview to production Go

Changes from Revision B (August 2020) to Revision C (December 2020)

  • Changed the slew rate from 315 V/µs to 230 V/µs in the Features sectionGo
  • Updated Gain of 10 V/V PCM Audio DAC Output with 2nd-Order MFB Filter in the Features sectionGo
  • Releasing the WQFN (10) package for the in the THS4561 deviceGo
  • Changed the status of the RUN package from preview to production Go
  • Seperated slew rate specification into rising and falling specifications linesGo
  • Changed the VOCM small-signal bandwidth test condition from 100 mVPP to 10 mVPP and the typical value from 23 MHz to 22 MHz Go
  • Changed the VOCM large-signal bandwidth typical value from 10 MHz to 1.9 MHz Go
  • Changed the maximum VOCM drift specification from 300 µV/°C Go
  • Updated the Common-Mode Voltage, Small-Signal and Large-Signal Response (VOCM Pin Driven) figure in the Typical Characteristics: (VS+) – (VS–) = 3-V to 12-V Supply Range section Go
  • Updated the MFB Filter Driving an ADC Application figure in the Typical Application section Go

Changes from Revision A (December 2019) to Revision B (August 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added the VQFN-10 and VQFN-16 Package OutlinesGo

Changes from Revision * (August 2017) to Revision A (December 2019)

  • Changed device status from advance information to production dataGo