SBOS758F April   2016  – June 2024 THS6212

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics VS = 12 V
    6. 5.6 Electrical Characteristics VS = 28 V
    7. 5.7 Timing Requirements
    8. 5.8 Typical Characteristics: VS = 12 V
    9. 5.9 Typical Characteristics: VS = 28 V
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Voltage and Current Drive
      2. 6.3.2 Driving Capacitive Loads
      3. 6.3.3 Distortion Performance
      4. 6.3.4 Differential Noise Performance
      5. 6.3.5 DC Accuracy and Offset Control
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Wideband Current-Feedback Operation
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Dual-Supply Downstream Driver
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Line Driver Headroom Requirements
          2. 7.2.2.2.2 Computing Total Driver Power for Line-Driving Applications
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHF|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information
7.2.2.2.2 Computing Total Driver Power for Line-Driving Applications

The total internal power dissipation for the THS6212 in a line-driver application is the sum of the quiescent power and the output stage power. The THS6212 holds a relatively constant quiescent current versus supply voltage—giving a power contribution that is simply the quiescent current times the supply voltage used (the supply voltage is greater than the solution given in Equation 15). The total output stage power can be computed with reference to Figure 7-8.

THS6212 Output Stage Power Model Figure 7-8 Output Stage Power Model

The two output stages used to drive the load of Figure 7-5 are shown as an H-Bridge in Figure 7-8. The average current drawn from the supply into this H-Bridge and load is the peak current in the load given by Equation 13 divided by the crest factor (CF) for the signal modulation. This total power from the supply is then reduced by the power in RT, leaving the power dissipated internal to the drivers in the four output-stage transistors. That power is simply the target line power used in Equation 8 plus the power lost in the matching elements (RM). In the following examples, a perfect match is targeted giving the same power in the matching elements as in the load. The output stage power is then set by Equation 17.

Equation 17. THS6212

The total amplifier power is then given by Equation 18:

Equation 18. THS6212

For the example given by Figure 7-4, the peak current is 159 mA for a signal that requires a crest factor of 5.6 with a target line power of 20.5 dBm into a 100-Ω load (115 mW).

With a typical quiescent current of 19.5mA and a nominal supply voltage of ±14V, the total internal power dissipation for the solution of Figure 7-4 is given by Equation 19:

Equation 19. THS6212