SBOS431A May   2009  – March 2017 THS6214

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: VS = ±12 V
    6. 6.6  Electrical Characteristics: VS = ±6 V
    7. 6.7  Timing Requirements
    8. 6.8  Typical Characteristics: VS = ±12 V, Full Bias
    9. 6.9  Typical Characteristics: VS = ±12 V, Mid Bias
    10. 6.10 Typical Characteristics: VS = ±12 V, Low Bias
    11. 6.11 Typical Characteristics: VS = ±6 V, Full Bias
    12. 6.12 Typical Characteristics: VS = ±6 V, Mid Bias
    13. 6.13 Typical Characteristics: VS = ±6 V, Low Bias
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Current and Voltage
      2. 7.3.2 Driving Capacitive Loads
      3. 7.3.3 Distortion Performance
      4. 7.3.4 Differential Noise Performance
      5. 7.3.5 DC Accuracy and Offset Control
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Wideband Current-Feedback Operation
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Dual-Supply VDSL Downstream Driver
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Line Driver Headroom Model Requirements
          2. 8.2.2.2.2 Total Driver Power for xDSL Applications
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Board Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.