SBOS431A May   2009  – March 2017 THS6214

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: VS = ±12 V
    6. 6.6  Electrical Characteristics: VS = ±6 V
    7. 6.7  Timing Requirements
    8. 6.8  Typical Characteristics: VS = ±12 V, Full Bias
    9. 6.9  Typical Characteristics: VS = ±12 V, Mid Bias
    10. 6.10 Typical Characteristics: VS = ±12 V, Low Bias
    11. 6.11 Typical Characteristics: VS = ±6 V, Full Bias
    12. 6.12 Typical Characteristics: VS = ±6 V, Mid Bias
    13. 6.13 Typical Characteristics: VS = ±6 V, Low Bias
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Current and Voltage
      2. 7.3.2 Driving Capacitive Loads
      3. 7.3.3 Distortion Performance
      4. 7.3.4 Differential Noise Performance
      5. 7.3.5 DC Accuracy and Offset Control
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Wideband Current-Feedback Operation
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Dual-Supply VDSL Downstream Driver
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Line Driver Headroom Model Requirements
          2. 8.2.2.2.2 Total Driver Power for xDSL Applications
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Board Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from * Revision (May 2009) to A Revision

  • Added Device Information table, Pin Functions table, ESD Ratings table, Recommended Operating Conditions table, Thermal Information table, Timing Requirements table, Overview section, Functional Block Diagram section, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Added last Applications bullet Go
  • Added last sentence to first paragraph of Description section Go
  • Changed QFN to VQFN and TSSOP to HTSSOP throughout document Go
  • Deleted Ordering Information table Go
  • Deleted Dissipation Ratings table Go
  • Changed second paragraph of Distortion Performance section for clarityGo