SBOS974F August   2019  – December 2024 THS6222

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics VS = 12 V
    6. 5.6 Electrical Characteristics VS = 32 V
    7. 5.7 Timing Requirements
    8. 5.8 Typical Characteristics: VS = 12 V
    9. 5.9 Typical Characteristics: VS = 32 V
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Common-Mode Buffer
      2. 6.3.2 Thermal Protection and Package Power Dissipation
      3. 6.3.3 Output Voltage and Current Drive
      4. 6.3.4 Breakdown Supply Voltage
      5. 6.3.5 Surge Test Results
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Broadband PLC Line Driving
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Best Design Practices
      1. 7.3.1 Do
      2. 7.3.2 Do Not
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
        1. 7.5.1.1 Wafer and Die Information
      2. 7.5.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGT|16
  • YS|0
  • RHF|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Supply range (VS): 8V to 32V
  • Integrated midsupply common-mode buffer
  • Large-signal bandwidth: 195MHz (VO = 16VPP)
  • Slew rate (16V step): 5500V/µs
  • Low distortion (VS = 12V, 50Ω load):
    • HD2: –80dBc (1MHz)
    • HD3: –90dBc (1MHz)
  • Output current: 338mA (VS = 12V, 25Ω load)
  • Wide output swing (VS = 12V):
    • 19.4VPP (100Ω load)
    • 18.6VPP (50Ω load)
  • Adjustable power modes:
    • Full-bias mode: 19.5mA
    • Mid-bias mode: 15mA
    • Low-bias mode: 10.4mA
    • Low-power shutdown mode
    • IADJ pin for variable bias
  • Integrated overtemperature protection
  • High performance upgrade to the THS6212