SBOS974F August   2019  – December 2024 THS6222

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics VS = 12 V
    6. 5.6 Electrical Characteristics VS = 32 V
    7. 5.7 Timing Requirements
    8. 5.8 Typical Characteristics: VS = 12 V
    9. 5.9 Typical Characteristics: VS = 32 V
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Common-Mode Buffer
      2. 6.3.2 Thermal Protection and Package Power Dissipation
      3. 6.3.3 Output Voltage and Current Drive
      4. 6.3.4 Breakdown Supply Voltage
      5. 6.3.5 Surge Test Results
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Broadband PLC Line Driving
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Best Design Practices
      1. 7.3.1 Do
      2. 7.3.2 Do Not
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
        1. 7.5.1.1 Wafer and Die Information
      2. 7.5.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGT|16
  • YS|0
  • RHF|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.2 Thermal Protection and Package Power Dissipation

The THS6222 is designed with thermal protection that automatically puts the device in shutdown mode when the junction temperature reaches approximately 175°C. In this mode, the device behavior is the same as if the bias pins are used to power-down the device. The device resumes normal operation when the junction temperature reaches approximately 145°C. In general, the thermal shutdown condition must be avoided. If and when the thermal protection triggers, thermal cycling occurs where the device repeatedly goes in and out of thermal shutdown until the junction temperature stabilizes to a value that prevents thermal shutdown.

A common technique to calculate the maximum power dissipation that a device can withstand is by using the junction-to-ambient thermal resistance (RθJA), provided in the Thermal Information table. Using the equation power dissipation = (junction temperature, TJ – ambient temperature, TA) / RθJA, the amount of power a package can dissipate can be estimated. Figure 6-2 illustrates the package power dissipation based on this equation to reach junction temperatures of 125°C and 150°C at various ambient temperatures. The RθJA value is determined using industry standard JEDEC specifications and allows ease of comparing various packages. Power greater than that in Figure 6-2 can be dissipated in a package by good printed circuit board (PCB) thermal design, using heat sinks, and or active cooling techniques. See the Thermal Design By Insight, Not Hindsight application report for an in-depth discussion on thermal design.

THS6222 Package Power Dissipation vs Ambient TemperatureFigure 6-2 Package Power Dissipation vs Ambient Temperature