SBOSAI6 June   2024 THS6232

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics VS = 12V
    6. 5.6 Electrical Characteristics VS = 40V
    7. 5.7 Timing Requirements
    8. 5.8 Typical Characteristics VS = 12V
    9. 5.9 Typical Characteristics VS = 40V
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Common-Mode Buffer
      2. 6.3.2 Thermal Protection and Package Power Dissipation
      3. 6.3.3 Output Voltage and Current Drive
      4. 6.3.4 Breakdown Supply Voltage
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Broadband PLC Line Driving
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Examples
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHF|24
Thermal pad, mechanical data (Package|Pins)

Output Voltage and Current Drive

The THS6232 provides output voltage and current capabilities that provide high-voltage and high-current capabilities in a low-cost, monolithic op amp. Under a 100Ω differential load, the output voltage has a typical swing of 21VPP. Under a 25Ω differential load, the output voltage has a typical swing of 16VPP. The THS6232 can also deliver over 310mA of current with a 25Ω load.

If the THS6232 is pushed to the limits of the output drive capabilities, good thermal design of the system is important, including the use of heat sinks and active cooling methods. Figure 6-2, Figure 6-3 and Figure 6-4 show the output drive of the THS6232 under different sets of conditions, where TA is approximately equal to TJ. In practical applications, TJ is often much higher than TA and highly depends on the device configuration, signal parameters, and PCB thermal design. To represent the full output-drive capability of the THS6232, TJ ≅ TA is achieved by pulsing or sweeping the output current for a duration of less than 100ms.

THS6232 Slammed
            Single-Ended Output Voltage vs IO and Temperature
VS = 12V, TJ ≅ TA
Figure 6-2 Slammed Single-Ended Output Voltage vs IO and Temperature
THS6232 Linear Single-Ended Output Voltage vs IO and
            Temperature
VS = 12V, TJ ≅ TA ≅ 25°C
Figure 6-4 Linear Single-Ended Output Voltage vs IO and Temperature
THS6232 Linear
            Single-Ended Output Voltage vs Bias Modes
VS = 12V, TJ ≅ TA ≅ 25°C
Figure 6-3 Linear Single-Ended Output Voltage vs Bias Modes

In Figure 6-2, the output voltages are differentially slammed to the rail and the output current is single-endedly sourced or sunk using a source measure unit (SMU) for less than 100ms. The single-ended output voltage of each output is then measured prior to removing the load current. After removing the load current, the outputs are brought back to midsupply before repeating the measurement for different load currents. This entire process is repeated for each ambient temperature. Under the slammed output voltage condition of Figure 6-2, the output transistors are in the triode region and the transistors start going into linear operation as the output swing is backed off for a given IO.

In Figure 6-3 and Figure 6-4, the inputs are floated and the output voltages are allowed to settle to the midsupply voltage. The load current is then single-endedly swept for sourcing (greater than 0mA) and sinking (less than 0mA) conditions and the single-ended output voltage is measured at each current-forcing condition. The current sweep is completed in approximately 3s to 4s so as not to significantly raise the junction temperature (TJ) of the device from the ambient temperature (TA). The output is not swinging and the output transistors are in linear operation until the current drawn exceeds the device capabilities, at which point the output voltage starts to deviate quickly from the no-load output voltage.

To maintain maximum output stage linearity, output short-circuit protection is not provided. This absence of short-circuit protection is normally not a problem because most applications include a series-matching resistor at the output that limits the internal power dissipation if the output side of this resistor is shorted to ground. However, in most cases, shorting the output pin directly to the adjacent positive power-supply pin permanently damages the amplifier.