SBOS877A April   2018  – September 2018 THS6301

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      MTPR G.Fast 212 MHz (Bias 10, PAR = 15 dB, 1-in-64 Missing Tones)
      2.      Multitone Power Ratio (MTPR) Profile (G.Fast, 212 MHz, 8 dBm)
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power Dissipation and Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Power Supply Recommendations

The THS6301 is recommended to operate using a total supply voltage of 12 V. If a lower or higher supply voltage is required, select one that is between 11.4 V and 12.6 V for optimal performance. Use supply-decoupling capacitors on the power-supply pins to minimize distortion caused by parasitic signals on the power supply. This usage is especially important in applications where many devices share a single power-supply bus.

The device can be operated on split supplies (such as ±6 V). However, the bias adjust resistor must be tied to the negative supply for proper device operation. When operating the device on split supply, pins 4 and 10 act as the negative supply voltage pin. The thermal pad must be tied to either GND or the negative supply voltage in split-supply operation. The device bias mode pins are now referenced to the negative supply voltage for the different logic levels.

As with all high-speed amplifiers, supply bypass capacitors are required for operation of the THS6301. Multiple capacitors are required to cover the entire frequency range of the device. For low frequency bypassing use a 10 µF or larger tantalum capacitor (see the description of C1 in the THS6301EVM User's Guide). Place this capacitor within two or three centimeters of the amplifier. Use 0.1-µF and 1-nF high-frequency bypass capacitors (these capacitors are labeled C2 and C3 on the EVM). Place these capacitors within two to three millimeters of the amplifier and must be directly connected to the power-supply planes with low-impedance vias. Texas Instruments recommends using the capacitors shown in the bill of materials (BOM) that accompanies the THS6301EVM User's Guide. The capacitor part numbers are listed in the THS6301EVM user's guide.