SBOS877A April   2018  – September 2018 THS6301

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      MTPR G.Fast 212 MHz (Bias 10, PAR = 15 dB, 1-in-64 Missing Tones)
      2.      Multitone Power Ratio (MTPR) Profile (G.Fast, 212 MHz, 8 dBm)
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power Dissipation and Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIH Minimum logic high level All digital pins, high 2.3 V
VIL Maximum logic low level All digital pins, low 0.6 V
VMID Logic mid range All digital pins, driven externally 1.2 1.6 V
VFloat Logic self-bias voltage All digital pins, floating 1.3 1.4 1.5 V
IIH Logic high-level leakage current All digital pins, logic level = 3.6 V 110 135 µA
IIL Logic low-level leakage current All digital pins, logic level = ground –85 –75 µA
Turn-on switching time High power line termination mode (00) to drive mode 6 (10, G.Fast high power) 64 ns
Low power line termination mode (Z0) to drive mode 6 (10, G.Fast high power) 50
Power down mode (ZZ) to Drive mode 6 (10, G.Fast high power) 60
Turn-off switching time Drive mode 6 (10, G.Fast high power) to high power line termination mode (00) 76 ns
Drive mode 6 (10, G.Fast high power) to low power line termination mode (Z0) 400
Drive mode 6 (10, G.Fast high power) to power-down mode (ZZ) 380