SLOS932 December   2015 THS7530-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: Main Amplifier
    6. 6.6 Package Thermal Data
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Continually-Variable Gain Control
      2. 8.3.2 Common-Mode Voltage Control
      3. 8.3.3 Output Voltage Clamps
      4. 8.3.4 Power-Down Mode
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range, unless otherwise noted.(1)
MIN MAX UNIT
VS+ – VS– Supply voltage 5.5 V
VI Input voltage ±VS V
IO Output current 65 mA
VID Differential input voltage ±4 V
Continuous power dissipation See Thermal Information
TJ Maximum junction temperature 150 °C
Maximum junction temperature for long term stability(2) 125 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of the device.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V
Charged-device model (CDM), per AEC Q100-011 ±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
[VS– to VS+] Supply voltage 4.5 5 5.5 V
Input common mode voltage [VS– to VS+] = 5 V 2.5 V
Output common mode voltage [VS– to VS+] = 5 V 2.5 V
TA Operating free-air temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) THS7530 UNIT
PWP (HTSSOP)
14 PINS
RθJA Junction-to-ambient thermal resistance 75.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 35 °C/W
RθJB Junction-to-board thermal resistance 28.9 °C/W
ψJT Junction-to-top characterization parameter 1.6 °C/W
ψJB Junction-to-board characterization parameter 28.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics: Main Amplifier

VS+ = 5 V, VS– = 0 V, VOCM = 2.5 V, VICM = 2.5 V, VG- = 0 V, VG+ = 1 V (maximum gain), TA = 25°C, AC performance measured using the AC test circuit shown in Figure 16 (unless otherwise noted). DC performance is measured using the DC test circuit shown in Figure 17 (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
AC PERFORMANCE
Small-signal bandwidth All gains, PIN = –45 dBm 300 MHz
Slew rate(1) 1-VPP Step, 25% to 75%, minimum gain 1250 V/µs
Settling time to 1%(1) 1-VPP Step, minimum gain 11 ns
Harmonic distortion, 2nd harmonic f = 32 MHz, VO(PP) = 1 V, RL(diff)= 400 Ω –65 dBc
Harmonic distortion, 3rd harmonic f = 32 MHz, VO(PP) = 1 V, RL(diff)= 400 Ω –61 dBc
Third-order intermodulation distortion PO = –10 dBm each tone, fC= 70 MHz,
200-kHz tone spacing		 –62 dBc
Third-order output intercept point fC= 70 MHz, 200-kHz tone spacing 21 dBm
Noise figure (with input termination) Source impedance: 50 Ω 9 dB
Total input voltage noise f > 100 kHz 1.1 nV/√Hz
DC PERFORMANCE—INPUTS
Input bias current TA = 25°C 20 39 µA
TA = –40°C to +125°C 40
Input bias current offset <150 pA
Minimum input voltage Minimum gain, TA = 25°C 1.5 1.6 V
Minimum gain, TA = –40°C to +125°C 1.7
Maximum input voltage Minimum gain, TA = 25°C 3.2 3.3 V
Minimum gain, TA = –40°C to +125°C 3.15
Common-mode rejection ratio TA = 25°C 56 114 dB
TA = –40°C to +125°C 44
Differential input impedance 8.5 || 3 kΩ || pF
DC PERFORMANCE—OUTPUTS
Output offset voltage All gains, TA = 25°C ±100 ±410 mV
All gains, TA = –40°C to +125°C ±480
Maximum output voltage high TA = 25°C 3.25 3.5 V
TA = –40°C to +125°C 3
Minimum output voltage low TA = 25°C 1.5 1.8 V
TA = –40°C to +125°C 2
Output current TA = 25°C ±16 ±30 mA
TA = –40°C to +125°C ±16
Output impedance 15 Ω
OUTPUT COMMON-MODE VOLTAGE CONTROL
Small-signal bandwidth 32 MHz
Gain 1 V/V
Common-mode offset voltage TA = 25°C 4.5 12 mV
TA = –40°C to +125°C 13.8
Minimum input voltage 1.75 V
Maximum input voltage 3.25 V
Input impedance 25 || 1 kΩ || pF
Default voltage, with no connect 2.5 V
Input bias current <1 µA
GAIN CONTROL
Gain control differential voltage range VG+ 0 to 1 V
Minus gain control voltage VG– – VS– –0.6 to 0.8 V
Minimum gain VG+ = 0 V 11.6 dB
Maximum gain VG+ = 0.9 V 46.5 dB
Gain slope VG+ = 0 V to 0.9 V 38.8 dB/V
Gain slope variation VG+ = 0 V to 0.9 V ±1.5 dB/V
Gain error VG+ = 0 V to 0.15 V ±4 dB
VG+ = 0.15 V to 0.9 V ±2.25
Gain control input bias current <1 µA
Gain control input resistance 40 kΩ
Gain control bandwidth Small signal –3 dB 15 MHz
VOLTAGE CLAMPING
Output voltages (VOUT±) relative to clamp voltages (VCL±) Device In voltage limiting mode, TA = 25°C ±25 ±40 mV
Device In voltage limiting mode, TA = –40°C to +125°C ±180
Clamp voltage (VCL±) input resistance Device in voltage limiting mode 3.3 kΩ
Clamp voltage (VCL±) limits VS– to VS+ V
POWER SUPPLY
Specified operating voltage TA = 25°C 5 5.5 V
TA = –40°C to +125°C 5.5
Maximum quiescent current TA = 25°C 40 48 mA
TA = –40°C to +125°C 49
Power supply rejection (±PSRR) TA = 25°C 70 77 dB
TA = –40°C to +125°C 45
POWER DOWN
Enable voltage threshold TTL low = shut down, TA = 25°C 1.4 V
TTL low = shut down,
TA = –40°C to +125°C		 1
Disable voltage threshold TTL high = normal operation, TA = 25°C 1.4 V
TTL high = normal operation,
TA = –40°C to +125°C		 1.65
Power-down quiescent current TA = 25°C 0.35 0.4 mA
TA = –40°C to +125°C 0.55
Input current high TA = 25°C ±9 ±16 µA
TA = –40°C to +125°C ±19
Input current low TA = 25°C ±109 ±116 µA
TA = –40°C to +125°C ±130
Input impedance 50 || 1 kΩ || pF
Turnon time delay Measured to 50% quiescent current 820 ns
Turnoff time delay Measured to 50% quiescent current 500 ns
Forward isolation in power down 80 dB
Input resistance in power down > 1 MΩ
Output resistance in power down 16 kΩ
(1) Slew rate and settling time measured at amplifier output.

6.6 Package Thermal Data

PACKAGE PCB TA = 25°C
POWER RATING(1)
PWP (14-pin)(2) See Layout. 3 W
(1) This data was taken using 2 oz trace and copper pad that is soldered directly to a 3 in × 3 in PCB.
(2) The THS7530-Q1 incorporates a PowerPAD on the underside of the chip. The PowerpAD acts as a heatsink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical briefs SLMA002 and SLMA004 for more information about using the PowerPAD thermally enhanced package.

6.7 Typical Characteristics

Measured using the AC test circuit shown in Figure 16 (unless otherwise noted).

Table 1. Table Of Graphs

FIGURE
Voltage Gain to Load vs Frequency (Input at 45 dBm) Figure 1
Gain and Gain Error vs VG+ Figure 2
Noise Figure vs Frequency Figure 3
Output Intercept Point vs Frequency Figure 4
1-dB Compression Point vs Frequency Figure 5
Total Input Voltage Noise vs Frequency Figure 6
Intermodulation Distortion vs Frequency Figure 7
Harmonic Distortion vs Frequency Figure 8
S-Parameters vs Frequency Figure 24
Differential Input Impedance of Main Amplifier vs Frequency Figure 25
Differential Output Impedance of Main Amplifier vs Frequency Figure 9
VG+ Input Impedance vs Frequency Figure 10
VOCM Input Impedance vs Frequency Figure 11
Common-Mode Rejection Ratio vs Frequency Figure 12
Step Response: 2 VPP vs Time Figure 13
Step Response: Rising Edge vs Time Figure 14
Step Response: Falling Edge vs Time Figure 15
THS7530-Q1 tc_vgain_load_v_fqcy_los405.gif
Gain is taken at load. Add 6 dB to refer to amplifier output
PIN = –45 dBm
Figure 1. Voltage Gain to Load vs Frequency
THS7530-Q1 tc_gain_gerr_v_vg_los405.gif
Figure 2. Gain and Gain Error vs VG+
THS7530-Q1 tc_noise_fig_v_fqcy_los405.gif
Terminated input
Figure 3. Noise Figure vs Frequency
THS7530-Q1 tc_compres_pt_v_fqcy_los405.gif
Taken at load. Add 3 dB to refer to amplifier output.
Figure 5. 1-dB Compression Point vs Frequency
THS7530-Q1 tc_imd_v_fqcy_los405.gif
VG+ = 1 V VO = 1 VPP (composite) RL = 400 Ω
Figure 7. Intermodulation Distortion vs Frequency
THS7530-Q1 tc_diff_out_imped_v_fqcy_los405.gif
Figure 9. Differential Output Impedance of Main Amplifier
vs Frequency
THS7530-Q1 tc_vocm_in_imped_v_fqcy_los405.gif
Figure 11. VOCM Input Impedance vs Frequency
THS7530-Q1 tc_step_resp_los405.gif
RL = 400 Ω At amplifier output and minimum gain
Figure 13. Step Response
THS7530-Q1 tc_step_resp_fall_los405.gif
RL = 400 Ω At amplifier output and minimum gain
Figure 15. Step Response: Falling Edge
THS7530-Q1 tc_out_intcpt_v_fqcy_los405.gif
Taken at load. Add 3 dB to refer to amplifier output.
Figure 4. Output Intercept Point vs Frequency
THS7530-Q1 tc_total_vin_v_fqcy_los405.gif
Figure 6. Total Input Voltage Noise vs Frequency
THS7530-Q1 tc_harm_dist_v_fqcy_los405.gif
VG+ = 1 V VO = 1 VPP RL = 400 Ω
Figure 8. Harmonic Distortion vs Frequency
THS7530-Q1 tc_vg_in_imped_v_fqcy_los405.gif
Figure 10. VG+ Input Impedance vs Frequency
THS7530-Q1 tc_cmrr_v_fqcy_los405.gif
Figure 12. Common-Mode Rejection Ratio vs Frequency
THS7530-Q1 tc_step_resp_rise_los405.gif
RL = 400 Ω At amplifier output and minimum gain
Figure 14. Step Response: Rising Edge