SLOS776A September   2012  – December 2015 THS789

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Host Serial Interface DC Characteristics
    7. 6.7 Host Serial Interface AC Characteristics
    8. 6.8 Power Consumption
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Counter, Latches, Clock Multiplier
      2. 7.3.2 Channels, Interpolator
      3. 7.3.3 FIFO
      4. 7.3.4 Calibration, ALU, Tag, Shifter
      5. 7.3.5 Serial Interface, Temperature, Overhead
    4. 7.4 Device Functional Modes
      1. 7.4.1 Serial-Results Interface
      2. 7.4.2 Resister Map Descriptions for All Channels and Central Register
    5. 7.5 Programming
      1. 7.5.1 Host Processor Bus Interface
        1. 7.5.1.1  Serial Interface
        2. 7.5.1.2  Read vs Write Cycle
        3. 7.5.1.3  Parallel (Broadcast) Write
        4. 7.5.1.4  Address
        5. 7.5.1.5  Data
        6. 7.5.1.6  Reset
        7. 7.5.1.7  Chip ID
        8. 7.5.1.8  Read Operations
        9. 7.5.1.9  Write Operations
        10. 7.5.1.10 Write Operations to Multiple Destinations
      2. 7.5.2 Serial-Results Interface and ALU
        1. 7.5.2.1 Event Latches
        2. 7.5.2.2 FIFO
        3. 7.5.2.3 Result-Interface Operation
        4. 7.5.2.4 Serial Results Latency
        5. 7.5.2.5 TMU Calibration
        6. 7.5.2.6 Temperature Sensor
    6. 7.6 Register Maps
      1. 7.6.1 Register Address Space
      2. 7.6.2 Register Map Detail
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedures
        1. 8.2.2.1 Time Measurement
        2. 8.2.2.2 Output Clock to Data/Strobe Phasing
        3. 8.2.2.3 Master Clock Input and Clock Multiplier
        4. 8.2.2.4 Temperature Measurement and Alarm Circuit
        5. 8.2.2.5 LVDS-Compatible I/Os
        6. 8.2.2.6 LVDS-Compatible Inputs
        7. 8.2.2.7 LVDS-Compatible Outputs
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.2 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.