SLLSF78B December   2020  – October 2021 THVD1400 , THVD1420

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings [IEC]
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Dissipation Characteristics
    7. 5.7  Electrical Characteristics
    8. 5.8  Switching Characteristics (THVD1400)
    9. 5.9  Switching Characteristics (THVD1420)
    10. 5.10 Typical Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length
        2. 8.2.1.2 Stub Length
        3. 8.2.1.3 Bus Loading
        4. 8.2.1.4 Receiver Failsafe
        5. 8.2.1.5 Transient Protection
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Recommended Operating Conditions

MIN NOM MAX UNIT
VCC Supply voltage 3 5 5.5 V
VID Differential input voltage –12 12 V
VI Input voltage at any bus terminal(1) –7 12 V
VIH High-level input voltage (driver, driver-enable, and receiver-enable inputs)  2 5.5 V
VIL Low-level input voltage (driver, driver-enable, and receiver-enable inputs) 0 0.8 V
IO Output current Driver –60 60 mA
Receiver –8 8
RL Differential load resistance 54 60 Ω
1/tUI Signaling rate: THVD1400 500 kbps
1/tUI Signaling rate: THVD1420 12 Mbps
TJ Junction temperature –40 150 °C
TA(2) Operating ambient temperature –40 125 °C
TSHDN Thermal shutdown threshold (temperature rising) 150 170 °C
THYS Thermal shutdown hysteresis 15 °C
(1) The algebraic convention in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
(2) Operation is specified for internal (junction) temperatures up to 150°C. Self-heating due to internal power dissipation should be considered for each application. Maximum junction temperature is internally limited by the thermal shut-down (TSD) circuit which disables the driver outputs when the junction temperature reaches 170°C.