SLLSF87A May   2021  – November 2021 THVD1406 , THVD1426

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings - IEC Specifications
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Power Dissipation Characteristics
    7. 6.7  Electrical Characteristics
    8. 6.8  Switching Characteristics (THVD1406)
    9. 6.9  Switching Characteristics (THVD1426)
    10. 6.10 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Data Rate and Bus Length
        2. 9.2.1.2 Stub Length
        3. 9.2.1.3 Bus Loading
        4. 9.2.1.4 Receiver Failsafe
        5. 9.2.1.5 Transient Protection
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The THVD14x6 (THVD1406 and THVD1426) devices are robust half-duplex RS-485 transceivers for industrial applications. These devices feature auto-direction control using the data input pin that reduces the reliance on separate pins for driver-enable and the receiver-enable functionality. This reduces the number of isolation channels needed or number of the GPIO pins needed for logic control. The bus pins are immune to high levels of IEC ESD events eliminating need of additional system level protection components.

The devices operate from a single 3-V to 5.5-V supply. The wide common-mode voltage range and low input leakage on bus pins make devices suitable for multi-point applications over long cable runs.

The devices are available in industry standard 8-pin SOIC package for drop-in compatibility. The devices are also available in a small, space-saving SOT package. The devices are characterized for ambient temperatures from –40°C to 125°C.

Device Information
PART NUMBER PACKAGE(1) BODY SIZE (NOM)
THVD1406

THVD1426

SOIC (8) 4.90 mm × 3.91 mm
SOT (8) 2.10 mm x 1.20 mm
For all available packages, see the orderable addendum at the end of the data sheet.
GUID-20211108-SS0I-L0HC-BKB0-CCQSMZ4SH3N0-low.gif Simplified Schematic