SLLSFQ4A September   2022  – March 2023 THVD1424

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings [IEC]
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Power Dissipation
    7. 6.7  Electrical Characteristics
    8. 6.8  Switching Characteristics_500 kbps
    9. 6.9  Switching Characteristics_20 Mbps
    10. 6.10 Switching Characteristics_Termination resistor
    11. 6.11 Switching Characteristics_Duplex switching
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 On-Chip Switchable Termination
      2. 8.4.2 Operational Data rate
      3. 8.4.3 Protection Features
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Data Rate and Bus Length
        2. 9.2.1.2 Stub Length
        3. 9.2.1.3 Bus Loading
        4. 9.2.1.4 Receiver Failsafe
        5. 9.2.1.5 Transient Protection
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) 
MIN NOM MAX UNIT
VCC Supply voltage 3 5.5 V
VIO I/O supply voltage 1.65 VCC V
VI Input voltage at any bus terminal (separately or common mode)(1) –7 12 V
VIH High-level input voltage (D, DE, RE, TERM_TX, TERM_RX, SLR, H/F inputs) 0.7*VIO VIO V
VIL Low-level input voltage (D, DE, RE, TERM_TX, TERM_RX, SLR, H/F inputs) 0 0.3*VIO V
IO Output current, driver –60 60 mA
IOR Output current, receiver VIO = 1.8 V or 2.5 V –4 4 mA
IOR Output current, receiver VIO = 3.3 V or 5 V –8 8 mA
RL Differential load resistance 54 60 Ω
1/tUI Signaling rate SLR = VIO 500 kbps
SLR = GND or floating 20 Mbps
TA (2) Operating ambient temperature  -40 125 °C
TJ (2) Junction temperature  -40 150 °C
(1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
(2) Operation is specified for internal (junction) temperatures up to 150°C. Self-heating due to internal power dissipation should be considered for each application. Maximum junction temperature is internally limited by the thermal shut-down (TSD) circuit which disables the driver and receiver when the junction temperature reaches typical 170°C.