SLLSF79B April   2021  – September 2021 THVD1439 , THVD1439V , THVD1449 , THVD1449V

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings, IEC
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Power Dissipation
    7. 6.7  Electrical Characteristics
    8. 6.8  Switching Characteristics (THVD1439, THVD1439V)
    9. 6.9  Switching Characteristics (THVD1449, THVD1449V)
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Electrostatic Discharge (ESD) Protection
      2. 8.3.2 Electrical Fast Transient (EFT) Protection
      3. 8.3.3 Surge Protection
      4. 8.3.4 Enhanced Receiver Noise Immunity
      5. 8.3.5 Failsafe Receiver
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Data Rate and Bus Length
        2. 9.2.1.2 Stub Length
        3. 9.2.1.3 Bus Loading
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.8 Switching Characteristics (THVD1439, THVD1439V)

250-kbps devices (THVD1439, 39V), over recommended operating conditions. All typical values are at 25 ℃.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Driver
tr, tf Differential output rise/fall time RL = 54 Ω, CL = 50 pF See Figure 7-3  300 570 1200 ns
tPHL, tPLH Propagation delay 450 650 ns
tSK(P) Pulse skew, |tPHL – tPLH| 50 ns
tPHZ, tPLZ Disable time See Figure 7-4  and Figure 7-5 25 125 ns
tPZH, tPZL Enable time RE = 0 V 240 600 ns
RE = VCC 2 4 µs
tSHDN Pulse width (logic low) on DE pin to initiate device  shutdown RE = VCC 300 ns
Receiver
tr, tf Differential output rise/fall time CL = 15 pF See Figure 7-6  9 25 ns
tPHL, tPLH Propagation delay 70 110 ns
tSK(P) Pulse skew, |tPHL – tPLH| 7 ns
tPHZ, tPLZ Disable time 22 60 ns
tPZH(1),
tPZL(1),
tPZH(2),
tPZL(2) 		Enable time DE = VCC See Figure 7-7  120 185 ns
DE = 0 V See Figure 7-8  4 10 μs
tD(OFS) Delay to enter fail-safe operation CL = 15 pF See Figure 7-9  14 20 36 μs
tD(FSO) Delay to exit fail-safe operation 25 40 66 ns
tSHDN RE pulse width to initiate device shutdown DE = 0 V 300 ns