SLLSFQ5A january   2023  – july 2023 THVD1454

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings [IEC]
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Power Dissipation
    7. 6.7  Electrical Characteristics
    8. 6.8  Switching Characteristics_500 kbps
    9. 6.9  Switching Characteristics_20 Mbps
    10. 6.10 Switching Characteristics_Termination resistor
    11. 6.11 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 On-Chip Switchable Termination
      2. 8.4.2 Operational Data rate
      3. 8.4.3 Protection Features
  10. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Data Rate and Bus Length
        2. 9.2.1.2 Stub Length
        3. 9.2.1.3 Bus Loading
        4. 9.2.1.4 Receiver Failsafe
        5. 9.2.1.5 Transient Protection
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The THVD1454 is a flexible half-duplex RS-485 transceiver for industrial applications. The device has features such as on-chip, 120-Ω termination resistor and driver output slew rate control. Both the features are pin controlled. This enables the device to be used at any node location (end nodes or middle nodes) in any network, slow or fast. End-equipment designers can now design a common printed circuit board (PCB), and configure the PCB using software for various application needs. This can save design and qualification time for the customers.

The bus pins are immune to high levels of IEC Contact Discharge ESD events, eliminating the need for additional system level protection components. The device operates from a single 3-V to 5.5-V supply. The wide common-mode voltage range and low input leakage on bus pins makes the device suitable for multi-point applications over long cable runs.

THVD1454 is available in space-saving thermally efficient 10-VSON package (3 mm x 3 mm). The device is characterized for ambient temperature from –40°C to 125°C.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
THVD1454 VSON (10) 3 mm x 3 mm
(1) For the complete part number, see the orderable addendum at the end of the data sheet.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
GUID-20230105-SS0I-QMLG-LB2Z-FJDSDBMZ84HR-low.svg Simplified Application