SLLSF68 September   2019 THVD1505

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Network Application With Polarity Correction (POLCOR)
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings [IEC]
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Power Dissipation Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Driver
    2. 7.2 Receiver
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bus Polarity Correction
        1. 8.3.1.1 Passive Polarity Definition Using Fail-Safe Biasing Network
        2. 8.3.1.2 Active Polarity Definition by the Master Node
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Device Configuration
      2. 9.1.2 Bus Design
      3. 9.1.3 Fail-Safe Biasing for Passive Polarity Definition
      4. 9.1.4 Cable Length Versus Data Rate
      5. 9.1.5 Stub Length
      6. 9.1.6 Transient Protection
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Design and Layout Considerations For Transient Protection
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Recommended Operating Conditions

MIN NOM MAX UNIT
VCC Supply voltage 4.5 5 5.5 V
VID Differential input voltage –12 12 V
VI Input voltage at any bus terminal(1) –7 12 V
VIH High-level input voltage (driver, driver-enable, and receiver-enable inputs) 2 VCC V
VIL Low-level input voltage (driver, driver-enable, and receiver-enable inputs) 0 0.8 V
IO Output current Driver –60 60 mA
Receiver –8 8
RL Differential load resistance 54 60 Ω
1/tUI Signaling rate 0.3 1000 kbps
TJ Junction temperature –40 150 °C
TA(2) Operating ambient temperature (see Thermal Information for additional information) –40 125 °C
(1) The algebraic convention in which the least positive (most negative) limit is designated as minimum is used in this datasheet.
(2) Operation is specified for internal (junction) temperatures upto 150°C. Self-heating due to internal power dissipation should be considered for each application. Maximum junction temperature is internally limited by the thermal shutdown (TSD) circuit which disables the device when the junction temperature reaches 170°C.