SLLSEV1C September   2017  – December 2018 THVD1510 , THVD1512 , THVD1550 , THVD1551 , THVD1552

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      THVD1510 and THVD1550 Simplified Schematic
      2.      THVD1551 Simplified Schematic
      3.      THVD1512 and THVD1552 Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
    3.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Power Dissipation
    6. 7.6 Electrical Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Functional Modes for THVD1510 and THVD1550
      2. 9.4.2 Device Functional Modes for THVD1551
      3. 9.4.3 Device Functional Modes for THVD1512 and THVD1552
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Data Rate and Bus Length
        2. 10.2.1.2 Stub Length
        3. 10.2.1.3 Bus Loading
        4. 10.2.1.4 Receiver Failsafe
        5. 10.2.1.5 Transient Protection
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
    2. 13.2 Third-Party Products Disclaimer
    3. 13.3 Related Links
    4. 13.4 Receiving Notification of Documentation Updates
    5. 13.5 Community Resources
    6. 13.6 Trademarks
    7. 13.7 Electrostatic Discharge Caution
    8. 13.8 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Meets or Exceeds the Requirements of the TIA/EIA-485A Standard
  • 4.5 V to 5.5 V Supply Voltage
  • Integrated Bus I/O Protection
    • ± 30 kV HBM ESD
    • ± 18 kV IEC 61000-4-2 ESD Contact Discharge
    • ± 25 kV IEC 61000-4-2 ESD Air-Gap Discharge
    • ± 4 kV IEC 61000-4-4 Electrical Fast Transient
  • Extended Operational Common-mode: ± 15 V
  • Low EMI 500 kbps and 50 Mbps Data Rates
  • Extended Temperature Range: -40°C to 125°C
  • Large Receiver Hysteresis for Noise Rejection
  • Low Power Consumption
    • Low Standby Supply Current: < 1 µA
    • Current During Operation: < 1 mA
  • Glitch-Free Power-Up/Down for Hot Plug-in Capability
  • Open, Short, and Idle Bus Failsafe
  • 1/8 Unit Load Options (Up to 256 Bus Nodes)
  • Small-Size VSSOP Packages Save Board Space or SOIC for Drop-in Compatibility