SLLSFP5A January   2024  – August 2024 THVD2419 , THVD2429

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings - IEC Specifications
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Power Dissipation
    7. 6.7  Electrical Characteristics
    8. 6.8  Switching Characteristics 250kbps
    9. 6.9  Switching Characteristics 20Mbps
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Electrostatic Discharge (ESD) Protection
      2. 8.3.2 Electrical Fast Transient (EFT) Protection
      3. 8.3.3 Surge Protection
      4. 8.3.4 Enhanced Receiver Noise Immunity
      5. 8.3.5 Failsafe Receiver
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Data Rate and Bus Length
        2. 9.2.1.2 Stub Length
        3. 9.2.1.3 Bus Loading
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.8 Switching Characteristics 250kbps

250kbps (THVD2419) over recommended operating conditions. All typical values are at 25°C and supply voltage of VCC = 5V , VIO = 3.3V, unless otherwise noted. (1) 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Driver
tr, tf Differential output rise/fall time RL = 54 Ω, CL = 50 pF 
See Figure 7-3		 VCC = 3 to 3.6V, Typical at 3.3V 400 625 1200 ns
VCC = 4.5 to 5.5V, Typical at 5V 500 725 1200 ns
tPHL, tPLH Propagation delay RL = 54 Ω, CL = 50 pF 
See Figure 7-3		 510 750 ns
tSK(P) Pulse skew, |tPHL – tPLH| 5 70 ns
tPHZ, tPLZ Disable time See Figure 7-4 and Figure 7-5 RE = X 45 75 ns
tPZH, tPZL Enable time RE = 0V 80 290 ns
RE = VIO  2.5 4.5 µs
tSHDN Time to shutdown RE = VIO 50 500 ns
Receiver
tr, tf Output rise/fall time CL = 15 pF
See Figure 7-6		 3 20 ns
tPHL, tPLH Propagation delay 750 1270 ns
tSK(P) Pulse skew, |tPHL – tPLH| 5 45 ns
tPHZ, tPLZ Disable time DE = X 30 40 ns
tPZH(1) Enable time 80 130 ns
tPZL(1) Enable time See Figure 7-7 800 1320 ns
tPZH(2),
tPZL(2)		 Enable time See Figure 7-8 DE = 0V 3 5.4 μs
tD(OFS) Delay to enter fail-safe operation See Figure 7-9 CL = 15pF 7 11 18 μs
tD(FSO) Delay to exit fail-safe operation 540 750 1260 ns
tSHDN Time to shutdown See Figure 7-8 DE = 0V 50 500 ns
(1) A, B are driver output and receiver input terminals for Half duplex devices. A, B are RX input, Y/Z are driver output terminals for Full duplex device