SLLSF20B July   2019  – October 2021 THVD2410 , THVD2450

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings [IEC]
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Power Dissipation
    7. 6.7  Electrical Characteristics
    8. 6.8  Switching Characteristics: THVD2410
    9. 6.9  Switching Characteristics: THVD2450
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 ±70-V Fault Protection
      2. 8.3.2 Integrated IEC ESD and EFT Protection
      3. 8.3.3 Driver Overvoltage and Overcurrent Protection
      4. 8.3.4 Enhanced Receiver Noise Immunity
      5. 8.3.5 Receiver Fail-Safe Operation
      6. 8.3.6 Low-Power Shutdown Mode
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Data Rate and Bus Length
        2. 9.2.1.2 Stub Length
        3. 9.2.1.3 Bus Loading
        4. 9.2.1.4 Transient Protection
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

THVD2410 and THVD2450 are ±70-V fault-protected, half-duplex, RS-422/RS-485 transceivers operating on a single 3-V to 5.5-V supply. Bus interface pins are protected against overvoltage conditions during all modes of operation ensuring robust communication in rugged industrial environments.

These devices feature integrated IEC ESD protection, eliminating the need for external system-level protection components. Extended ±25-V input common-mode range guarantees reliable data communication over longer cable run lengths and/or in the presence of large ground loop voltages. Enhanced 250-mV receiver hysteresis ensures high noise rejection. In addition, the receiver fail-safe feature guarantees a logic high when the inputs are open or shorted together.

THVD24x0 devices are available in small VSSOP and VSON packages for space-constrained applications. These devices are characterized over ambient free-air temperatures from –40°C to 125°C.

Device Information
PART NUMBER PACKAGE(1) BODY SIZE (NOM)
THVD2410
THVD2450		 VSON (8) 3.00 mm × 3.00 mm
VSSOP (8) 3.00 mm × 3.00 mm
SOIC (8) 4.90 mm × 3.91 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
GUID-81B67B07-5ED9-4E81-AA47-19EF4269C2E3-low.gif THVD2410 and THVD2450 Simplified Schematic