SLLSFQ9B May   2024  – October 2024 THVD2410V-EP , THVD2450V-EP , THVD2452V-EP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings [IEC]
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Dissipation
    7. 5.7  Electrical Characteristics
    8. 5.8  Switching Characteristics - 250 kbps
    9. 5.9  Switching Characteristics - 1 Mbps
    10. 5.10 Switching Characteristics - 20 Mbps
    11. 5.11 Switching Characteristics - 50 Mbps
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 ±70-V Fault Protection
      2. 7.3.2 Integrated IEC ESD and EFT Protection
      3. 7.3.3 Driver Overvoltage and Overcurrent Protection
      4. 7.3.4 Enhanced Receiver Noise Immunity
      5. 7.3.5 Receiver Fail-Safe Operation
      6. 7.3.6 Low-Power Shutdown Mode
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length
        2. 8.2.1.2 Stub Length
        3. 8.2.1.3 Bus Loading
        4. 8.2.1.4 Transient Protection
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Meets or exceeds the requirements of the TIA/EIA-485A and TIA/EIA-422B standards
  • Enhanced Product
    • Military temperature range (-55°C to 125°C)
    • One wafer fabrication site and one assembly and test site
    • Gold bond wire, NiPdAu lead finish
    • Wafer lot traceability
    • Extended product life cycle
  • 3V to 5.5V supply voltage
  • Differential output exceeds 2.1V for PROFIBUS
    compatibility with 5V supply
  • 1.65V to 5.5V Supply for data and enable signals
  • SLR Pin Selectable Data Rates:
    • THVD2410V-EP : 250kbps and 1Mbps
    • THVD2450V-EP, THVD2452V-EP: 20Mbps and 50Mbps
  • Bus I/O protection
    • ±70V DC bus fault
    • ±16kV HBM ESD
    • THVD2410V-EP, THVD2450V-EP
      • ±15kV IEC 61000-4-2 contact and air-gap discharge
    • THVD2452V-EP
      • ±8kV IEC 61000-4-2 contact and air-gap discharge
    • ±4kV IEC 61000-4-4 fast transient burst
  • Half-duplex and full-duplex devices available in two speed grades
  • Symmetric common mode voltage range: ±12V
  • Enhanced receiver hysteresis for noise immunity
  • Low power consumption
    • Low shutdown supply current: < 1µA
    • Current during operation: < 5.3mA
  • Glitch-free power-up/down for hot plug-in capability
  • Open, short, and idle bus failsafe
  • Thermal shutdown
  • 1/8 unit load (up to 256 bus nodes)
  • Small mm x 3mm VSON package (half-duplex) to save board space, or 14-D (full-duplex) for drop-in compatibility