SLLSFQ9B May   2024  – October 2024 THVD2410V-EP , THVD2450V-EP , THVD2452V-EP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings [IEC]
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Dissipation
    7. 5.7  Electrical Characteristics
    8. 5.8  Switching Characteristics - 250 kbps
    9. 5.9  Switching Characteristics - 1 Mbps
    10. 5.10 Switching Characteristics - 20 Mbps
    11. 5.11 Switching Characteristics - 50 Mbps
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 ±70-V Fault Protection
      2. 7.3.2 Integrated IEC ESD and EFT Protection
      3. 7.3.3 Driver Overvoltage and Overcurrent Protection
      4. 7.3.4 Enhanced Receiver Noise Immunity
      5. 7.3.5 Receiver Fail-Safe Operation
      6. 7.3.6 Low-Power Shutdown Mode
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length
        2. 8.2.1.2 Stub Length
        3. 8.2.1.3 Bus Loading
        4. 8.2.1.4 Transient Protection
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.9 Switching Characteristics - 1 Mbps

1Mbps (THVD2410V-EP with SLR = 0 or floating) over recommended operating conditions. All typical values are at 25°C and supply voltage of VCC = 5 V , VIO = 3.3 V, unless otherwise noted. (1) 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Driver
tr, tf Differential output rise/fall time VCC = 3 to 3.6 V, Typical at 3.3 V RL = 54 Ω, CL = 50 pF
See Figure 6-3		 125 150 300 ns
VCC = 4.5 to 5.5 V, Typical at 5 V 130 160 300 ns
tPHL, tPLH Propagation delay VCC = 3 to 3.6 V, Typical at 3.3 V 160 240 ns
VCC = 4.5 to 5.5 V, Typical at 5 V 185 280 ns
tSK(P) Pulse skew, |tPHL – tPLH| VCC = 3 to 3.6 V, Typical at 3.3 V 2 20 ns
VCC = 4.5 to 5.5 V, Typical at 5 V 2 15 ns
tPHZ, tPLZ Disable time RE = X See Figure 6-4 and Figure 6-5 40 95 ns
tPZH, tPZL Enable time RE = 0 V 90 275 ns
RE = VIO 3 4.6 µs
tSHDN Time to shutdown RE = VIO 50 500 ns
Receiver
tr, tf Output rise/fall time CL = 15 pF See Figure 6-6 7 15 ns
tPHL, tPLH Propagation delay 50 85 ns
tSK(P) Pulse skew, |tPHL – tPLH| 4 12.5 ns
tPHZ, tPLZ Disable time DE = X 30 40 ns
tPZH(1),
tPZL(1)		 Enable time VIO = 3 V to 3.6 V; DE = VIO See Figure 6-7 90 120 ns
VIO = 1.65 V to 1.95 V; DE = VIO 90 130 ns
tPZH(2),
tPZL(2)		 Enable time DE = 0 V See Figure 6-8 3 4.5 μs
tD(OFS) Delay to enter fail-safe operation CL = 15 pF See Figure 6-9 7 10 18 μs
tD(FSO) Delay to exit fail-safe operation 27 40 60 ns
tSHDN Time to shutdown DE = 0 V See Figure 6-8 50 500 ns
(1) A, B are driver output and receiver input terminals for Half duplex devices; A/B are Receiver input, Y/Z are driver output terminals for Full duplex device