SLLSFS0 April   2024 THVD4421

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings [IEC]
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Dissipation
    7. 5.7  Electrical Characteristics
    8. 5.8  Switching Characteristics_RS-485_500kbps
    9. 5.9  Switching Characteristics_RS-485_20Mbps
    10. 5.10 Switching Characteristics, Driver_RS232
    11. 5.11 Switching Characteristics, Receiver_RS232
    12. 5.12 Switching Characteristics_MODE switching
    13. 5.13 Switching Characteristics_RS-485_Termination resistor
    14. 5.14 Switching Characteristics_Loopback mode
    15. 5.15 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Integrated IEC ESD and EFT Protection
      2. 7.3.2 Protection Features
      3. 7.3.3 Receiver Fail-Safe Operation
      4. 7.3.4 Low-Power Shutdown Mode
      5. 7.3.5 On-chip Switchable Termination Resistor
      6. 7.3.6 Operational Data Rate
      7. 7.3.7 Diagnostic Loopback
      8. 7.3.8 Integrated Charge Pump for RS-232
    4. 7.4 Device Functional Modes
      1. 7.4.1 RS-485 Functionality
      2. 7.4.2 RS-232 Functionality
      3. 7.4.3 Mode Control
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length
        2. 8.2.1.2 Stub Length
        3. 8.2.1.3 Bus Loading
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.