SLLSFS0 April   2024 THVD4421

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings [IEC]
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Dissipation
    7. 5.7  Electrical Characteristics
    8. 5.8  Switching Characteristics_RS-485_500kbps
    9. 5.9  Switching Characteristics_RS-485_20Mbps
    10. 5.10 Switching Characteristics, Driver_RS232
    11. 5.11 Switching Characteristics, Receiver_RS232
    12. 5.12 Switching Characteristics_MODE switching
    13. 5.13 Switching Characteristics_RS-485_Termination resistor
    14. 5.14 Switching Characteristics_Loopback mode
    15. 5.15 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Integrated IEC ESD and EFT Protection
      2. 7.3.2 Protection Features
      3. 7.3.3 Receiver Fail-Safe Operation
      4. 7.3.4 Low-Power Shutdown Mode
      5. 7.3.5 On-chip Switchable Termination Resistor
      6. 7.3.6 Operational Data Rate
      7. 7.3.7 Diagnostic Loopback
      8. 7.3.8 Integrated Charge Pump for RS-232
    4. 7.4 Device Functional Modes
      1. 7.4.1 RS-485 Functionality
      2. 7.4.2 RS-232 Functionality
      3. 7.4.3 Mode Control
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length
        2. 8.2.1.2 Stub Length
        3. 8.2.1.3 Bus Loading
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Bus supply voltage VCC to GND –0.5 6 V
Logic supply voltage VIO to GND –0.5 VCC + 0.2 V
Charge pump positive-output supply voltage V+ to GND –0.3 14 V
Charge pump negative-output supply voltage V- to GND 0.3 -14 V
Charge pump capacitor terminals C1+ to GND VCC - 0.3 V+ V
Charge pump capacitor terminals C2+ to GND -0.3 V+ V
Charge pump capacitor terminals C1- to GND -0.3 VCC V
Charge pump capacitor terminals C2- to GND V- -0.3 V
Bus voltage Voltage at any bus pin (R1, R2, R3, R4) with respect to GND –16 16 V
Differential bus voltage (R1-R2) or (R2-R1), (R3-R4) or (R4-R3) with termination disabled -22 22 V
Differential bus voltage RS485 mode (R1-R2) or (R2-R1), (R3-R4) or (R4-R3) with termination enabled -6 6 V
Input voltage Range at any logic pin (L3, L4, SLR, SHDN, TERM_TX, TERM_RX, MODE0, MODE1, DIR) –0.3 VIO + 0.2 V
Receiver output current IO (L1, L2) –8 8 mA
Storage temperature Tstg –65 150 °C
Junction temperature TJ -40 170 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.