SLLSFD6A May   2020  – March 2021 THVD8000

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings - IEC Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Power Dissipation Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 OOK Modulation with F_SET pin
      2. 8.3.2 OOK Demodulation
      3. 8.3.3 Transmitter Timeout
      4. 8.3.4 Polarity Free Operation
      5. 8.3.5 Glitch Free Mode Change
      6. 8.3.6 Integrated IEC ESD and EFT Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 OOK Mode
      2. 8.4.2 Thermal shutdown (TSD)
  9. 9 Application Information Disclaimer
    1. 9.1 Application information
    2. 9.2 Typical application (OOK mode)
      1. 9.2.1 Design requirements
        1. 9.2.1.1 Carrier frequency
      2. 9.2.2 Detailed design procedure
        1. 9.2.2.1 Inductor value selection
        2. 9.2.2.2 Capacitor value selection
      3. 9.2.3 Application Curves
  10. 10Power supply recommendations
  11. 11Layout
    1. 11.1 Layout guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.9 Typical Characteristics

GUID-A09E7C5E-18DB-413E-9278-4AD9E31E3BBF-low.gif
RL = 60ΩData rate = ƒ0/10TX Enabled
Figure 6-1 ICC vs OOK Frequency