SLLSFK4
November 2020
THVD8010
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
ESD Ratings - IEC Specifications
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Power Dissipation Characteristics
6.8
Switching Characteristics
6.9
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagrams
8.3
Feature Description
8.3.1
OOK Modulation with F_SET pin
8.3.2
OOK Demodulation
8.3.3
Transmitter Timeout
8.3.4
Polarity Free Operation
8.3.5
Glitch Free Mode Change
8.3.6
Integrated IEC ESD and EFT Protection
8.4
Device Functional Modes
8.4.1
OOK Mode
8.4.2
Thermal shutdown (TSD)
9
Application and implementation
9.1
Application information
9.2
Typical application (OOK mode)
9.2.1
Design requirements
9.2.1.1
Carrier frequency
9.2.2
Detailed design procedure
9.2.2.1
Inductor value selection
9.2.2.2
Capacitor value selection
9.2.3
Application Curves
10
Power supply recommendations
11
Layout
11.1
Layout guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Device Support
12.2
Receiving Notification of Documentation Updates
12.3
Support Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DDF|8
MPDS569D
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sllsfk4_oa
sllsfk4_pm
6.9
Typical Characteristics
R
L
= 60Ω
Data rate = ƒ
0
/10
TX Enabled
Figure 6-1
ICC vs OOK Frequency
Figure 6-2
R
F_SET
vs OOK Frequency