SLLSFK4 November   2020 THVD8010

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings - IEC Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Power Dissipation Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 OOK Modulation with F_SET pin
      2. 8.3.2 OOK Demodulation
      3. 8.3.3 Transmitter Timeout
      4. 8.3.4 Polarity Free Operation
      5. 8.3.5 Glitch Free Mode Change
      6. 8.3.6 Integrated IEC ESD and EFT Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 OOK Mode
      2. 8.4.2 Thermal shutdown (TSD)
  9. Application and implementation
    1. 9.1 Application information
    2. 9.2 Typical application (OOK mode)
      1. 9.2.1 Design requirements
        1. 9.2.1.1 Carrier frequency
      2. 9.2.2 Detailed design procedure
        1. 9.2.2.1 Inductor value selection
        2. 9.2.2.2 Capacitor value selection
      3. 9.2.3 Application Curves
  10. 10Power supply recommendations
  11. 11Layout
    1. 11.1 Layout guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Switching Characteristics

over operating free-air temperature range (unless otherwise noted). All typical values are at 25°C and supply voltage of VCC = 5 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Driver
tr, tf Driver differential output rise and fall times RL = 60 Ω, CL = 50 pF, See Figure 7-4
 
8 30 ns
tPHL, tPLH Driver propagation delay
 
1 3.5 Clocks
tSK(P) Driver pulse skew, |tPHL – tPLH| 1 2.5 Clocks
Receiver
tr, tf Receiver output rise and fall times CL = 15 pF, See Figure 7-5
 
2 8 ns
tPHL, tPLH Receiver propagation delay time
 
4.5 6 Clocks
tSK(P) Receiver pulse skew, |tPHL – tPLH|
 
0.4 3
Device
tTX-RX_OOK Transmit to receive mode change delay, OOK mode Max of tTX-RX_OOK_ZERO and tTX-RX_OOK_ONE. See Figure 7-6 and Figure 7-7 14 clocks
tRX-TX_OOK Receive to transmit mode change delay, OOK mode See Figure 7-8 3 clocks
tTX_TIMEOUT Transmit timeout delay 60 110 s