SLLSFQ8B December   2024  – December 2024 THVD9491-SEP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings [IEC]
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Dissipation
    7. 5.7  Electrical Characteristics
    8. 5.8  Switching Characteristics: 20Mbps
    9. 5.9  Switching Characteristics: 50Mbps
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 ±40-V Fault Protection
      2. 7.3.2 Integrated IEC ESD and EFT Protection
      3. 7.3.3 Driver Overvoltage and Overcurrent Protection
      4. 7.3.4 Enhanced Receiver Noise Immunity
      5. 7.3.5 Receiver Fail-Safe Operation
      6. 7.3.6 Low-Power Shutdown Mode
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length
        2. 8.2.1.2 Stub Length
        3. 8.2.1.3 Bus Loading
        4. 8.2.1.4 Transient Protection
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.8 Switching Characteristics: 20Mbps

20-Mbps (SLR = VIO) over recommended operating conditions. All typical values are at 25°C and supply voltage of VCC = 5 V, VIO = 3.3 V, unless otherwise noted. (1) 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Driver
tr, tf Differential output rise/fall time RL = 54 Ω, CL = 50 pF
 		 See Figure 6-3 4 8 15 ns
tPHL, tPLH Propagation delay 6 15 30 ns
tSK(P) Pulse skew, |tPHL – tPLH| 1 3 ns
tPHZ, tPLZ Disable time RE = X See Figure 6-4 and Figure 6-3 17 35 ns
tPZH, tPZL Enable time RE = 0 V 14 39 ns
RE = VIO 3 4.5 μs
tSHDN Time to shutdown RE = VIO 50 500 ns
Receiver
tr, tf Output rise/fall time CL = 15 pF See Figure 6-6 1.5 6 ns
tPHL, tPLH Propagation delay 25 35 60 ns
tSK(P) Pulse skew, |tPHL – tPLH| 1 5 ns
tPHZ, tPLZ Disable time DE = X 12 25 ns
tPZH(1),
tPZL(1)		 Enable time DE = VIO See Figure 6-7 50 82 ns
tPZH(2),
tPZL(2)		 Enable time DE = 0 V See Figure 6-8 2.8 5 μs
tD(OFS) Delay to enter fail-safe operation CL = 15 pF See Figure 6-9 7 11 18 μs
tD(FSO) Delay to exit fail-safe operation 19 32 50 ns
tSHDN Time to shutdown DE = 0 V See Figure 6-8 50 500 ns
(1) A and B are receiver inputs, Y and Z are driver output terminals for the device