SCPS268A September   2017  – February 2022 TIC10024-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VS Pin
      2. 8.3.2  VDD Pin
      3. 8.3.3  Device Initialization
      4. 8.3.4  Device Trigger
      5. 8.3.5  Device Reset
        1. 8.3.5.1 VS Supply POR
        2. 8.3.5.2 Hardware Reset
        3. 8.3.5.3 Software Reset
      6. 8.3.6  VS Under-Voltage (UV) Condition
      7. 8.3.7  VS Over-Voltage (OV) Condition
      8. 8.3.8  Switch Inputs Settings
        1. 8.3.8.1 Input Current Source and Sink Selection
        2. 8.3.8.2 Input Enable Selection
        3. 8.3.8.3 Thresholds Adjustment
        4. 8.3.8.4 Wetting Current Configuration
      9. 8.3.9  Interrupt Generation and INT Assertion
        1. 8.3.9.1 INT Pin Assertion Scheme
        2. 8.3.9.2 Interrupt Idle Time (tINT_IDLE) Time
        3. 8.3.9.3 Microcontroller Wake-Up
        4. 8.3.9.4 Interrupt Enable / Disable And Interrupt Generation Conditions
        5. 8.3.9.5 Detection Filter
      10. 8.3.10 Temperature Monitor
        1. 8.3.10.1 Temperature Warning (TW)
        2. 8.3.10.2 Temperature Shutdown (TSD)
      11. 8.3.11 Parity Check And Parity Generation
      12. 8.3.12 Cyclic Redundancy Check (CRC)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Mode
      2. 8.4.2 Polling Mode
      3. 8.4.3 Additional Features
        1. 8.4.3.1 Clean Current Polling (CCP)
        2. 8.4.3.2 Wetting Current Auto-Scaling
  9. 9 Programming
    1. 9.1 SPI Communication Interface Buses
      1. 9.1.1 Chip Select ( CS)
      2. 9.1.2 System Clock (SCLK)
      3. 9.1.3 Slave In (SI)
      4. 9.1.4 Slave Out (SO)
    2. 9.2 SPI Sequence
      1. 9.2.1 Read Operation
      2. 9.2.2 Write Operation
      3. 9.2.3 Status Flag
    3. 9.3 Programming Guidelines
    4. 9.4 Register Maps
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Digital Switch Detection in Automotive Body Control Module
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Systems Examples
      1. 10.3.1 Using TIC10024-Q1 in a 12 V Automotive System
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Community Resources
    3. 13.3 Trademarks
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Timing Requirements

VS= 4.5 V to 35 V, VDD= 3 V to 5.5 V, and 10 pF capacitive load on SO unless otherwise noted; verified by design and characterization
MINNOMMAXUNIT
SWITCH MONITORING, INTERRUPT, STARTUP AND RESET
tPOLL_ACTPolling active time accuracyPolling mode-12%12%
tPOLLPolling time accuracyPolling mode-12%12%
tCOMPComparator detection time18µs
tCCP_TRANTransition time between last input sampling and start of clean current20µs
tCCP_ACTClean current active time-12%12%
tSTARTUPPolling startup time200300400µs
tINT_ACTIVEActive INT assertion duration1.522.5ms
tINT_INACTIVEINT de-assertion duration during a pending interrupt345ms
tINT_IDLEInterrupt idle time80100120µs
tRESETTime required to keep the RESET pin high to successfully reset the device (no pending interrupt)(1)2µs
tREACTDelay between a fault event (OV, UV, TW, or TSD) to a high to low transition on the INT pinSee Figure 7-2 for OV example.20µs
SPI INTERFACE
tLEADFalling edge of CS to rising edge of SCLK setup time100ns
tLAGFalling edge of SCLK to rising edge of CS setup time100ns
tSUSI to SCLK falling edge setup time30ns
tHOLDSI hold time after falling edge of SCLK20ns
tVALIDTime from rising edge of SCLK to valid SO data70ns
tSO(EN)Time from falling edge of CS to SO low-impedance60ns
tSO(DIS)Time from rising edge of CS to SO high-impedanceLoading of 1 kΩ to GND. See Figure 7-3.60ns
tRSI, CS, and SCLK signals rise time530ns
tFSI, CS, and SCLK signals fall time530ns
tINTER_FRAMEDelay between two SPI communication ( CS low) sequences1.5µs
tCKHSCLK High time120ns
tCKLSCLK Low time120ns
tINITIATIONDelay between valid VDD voltage and initial SPI communication45µs
(1) If there is a pending interrupt (/INT pin asserted low), it can take up to 1ms for the device to complete the reset.