SCPS268A September   2017  – February 2022 TIC10024-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VS Pin
      2. 8.3.2  VDD Pin
      3. 8.3.3  Device Initialization
      4. 8.3.4  Device Trigger
      5. 8.3.5  Device Reset
        1. 8.3.5.1 VS Supply POR
        2. 8.3.5.2 Hardware Reset
        3. 8.3.5.3 Software Reset
      6. 8.3.6  VS Under-Voltage (UV) Condition
      7. 8.3.7  VS Over-Voltage (OV) Condition
      8. 8.3.8  Switch Inputs Settings
        1. 8.3.8.1 Input Current Source and Sink Selection
        2. 8.3.8.2 Input Enable Selection
        3. 8.3.8.3 Thresholds Adjustment
        4. 8.3.8.4 Wetting Current Configuration
      9. 8.3.9  Interrupt Generation and INT Assertion
        1. 8.3.9.1 INT Pin Assertion Scheme
        2. 8.3.9.2 Interrupt Idle Time (tINT_IDLE) Time
        3. 8.3.9.3 Microcontroller Wake-Up
        4. 8.3.9.4 Interrupt Enable / Disable And Interrupt Generation Conditions
        5. 8.3.9.5 Detection Filter
      10. 8.3.10 Temperature Monitor
        1. 8.3.10.1 Temperature Warning (TW)
        2. 8.3.10.2 Temperature Shutdown (TSD)
      11. 8.3.11 Parity Check And Parity Generation
      12. 8.3.12 Cyclic Redundancy Check (CRC)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Mode
      2. 8.4.2 Polling Mode
      3. 8.4.3 Additional Features
        1. 8.4.3.1 Clean Current Polling (CCP)
        2. 8.4.3.2 Wetting Current Auto-Scaling
  9. 9 Programming
    1. 9.1 SPI Communication Interface Buses
      1. 9.1.1 Chip Select ( CS)
      2. 9.1.2 System Clock (SCLK)
      3. 9.1.3 Slave In (SI)
      4. 9.1.4 Slave Out (SO)
    2. 9.2 SPI Sequence
      1. 9.2.1 Read Operation
      2. 9.2.2 Write Operation
      3. 9.2.3 Status Flag
    3. 9.3 Programming Guidelines
    4. 9.4 Register Maps
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Digital Switch Detection in Automotive Body Control Module
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Systems Examples
      1. 10.3.1 Using TIC10024-Q1 in a 12 V Automotive System
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Community Resources
    3. 13.3 Trademarks
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.10 Temperature Monitor

With multiple switch inputs are closed and high wetting current setting is enabled, considerable power can be dissipated by the device and raise the device temperature. TIC10024-Q1 has integrated temperature monitoring and protection circuitry to put the device in low power mode to prevent damage due to overheating. Two types of temperature protection mechanisms are integrated in the device: Temperature Warning (TW) and Temperature Shutdown (TSD). The triggering temperatures and hysteresis are specified in Table 8-2 below:

Table 8-2 Temperature Monitoring Characteristics of TIC10024-Q1
PARAMETERMINTYPMAXUNIT
Temperature warning trigger temperature (TTW)130140155°C
Temperature shutdown trigger temperature (TTSD)150160175°C
Temperature hysteresis (THYS) for TTW and TTSD15°C