SCPS260C August   2017  – February 2022 TIC12400-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VS Pin
      2. 8.3.2  VDD Pin
      3. 8.3.3  Device Initialization
      4. 8.3.4  Device Trigger
      5. 8.3.5  Device Reset
        1. 8.3.5.1 VS Supply POR
        2. 8.3.5.2 Hardware Reset
        3. 8.3.5.3 Software Reset
      6. 8.3.6  VS Under-Voltage (UV) Condition
      7. 8.3.7  VS Over-Voltage (OV) Condition
      8. 8.3.8  Switch Inputs Settings
        1. 8.3.8.1 Input Current Source and Sink Selection
        2. 8.3.8.2 Input Mode Selection
        3. 8.3.8.3 Input Enable Selection
        4. 8.3.8.4 Thresholds Adjustment
        5. 8.3.8.5 Wetting Current Configuration
      9. 8.3.9  Interrupt Generation and INT Assertion
        1. 8.3.9.1 INT Pin Assertion Scheme
        2. 8.3.9.2 Interrupt Idle Time (tINT_IDLE) Time
        3. 8.3.9.3 Microcontroller Wake-Up
        4. 8.3.9.4 Interrupt Enable or Disable and Interrupt Generation Conditions
        5. 8.3.9.5 Detection Filter
      10. 8.3.10 Temperature Monitor
        1. 8.3.10.1 Temperature Warning (TW)
        2. 8.3.10.2 Temperature Shutdown (TSD)
      11. 8.3.11 Parity Check and Parity Generation
      12. 8.3.12 Cyclic Redundancy Check (CRC)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Mode
      2. 8.4.2 Polling Mode
        1. 8.4.2.1 Standard Polling
        2. 8.4.2.2 Matrix polling
      3. 8.4.3 Additional Features
        1. 8.4.3.1 Clean Current Polling (CCP)
        2. 8.4.3.2 Wetting Current Auto-Scaling
        3. 8.4.3.3 VS Measurement
        4. 8.4.3.4 Wetting Current Diagnostic
        5. 8.4.3.5 ADC Self-Diagnostic
    5. 8.5 Programming
      1. 8.5.1 SPI Communication Interface Buses
        1. 8.5.1.1 Chip Select ( CS)
        2. 8.5.1.2 System Clock (SCLK)
        3. 8.5.1.3 Slave In (SI)
        4. 8.5.1.4 Slave Out (SO)
      2. 8.5.2 SPI Sequence
        1. 8.5.2.1 Read Operation
        2. 8.5.2.2 Write Operation
        3. 8.5.2.3 Status Flag
    6. 8.6 Register Maps
    7. 8.7 Programming Guidelines
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Using TIC12400-Q1 in a 12 V Automotive System
    3. 9.3 Resistor-coded Switches Detection in Automotive Body Control Module
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
      3. 9.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-18BF8B18-242E-490F-A38B-23421FA531C1-low.gifFigure 5-1 DCP (TSSOP) Package, 38-Pin, Top View
Pin Functions
PIN TYPE(1) DESCRIPTION
NO. NAME
1 IN13 I/O Ground switch monitoring input with current source.
2 IN14 I/O Ground switch monitoring input with current source.
3 IN15 I/O Ground switch monitoring input with current source.
4 IN16 I/O Ground switch monitoring input with current source.
5 IN17 I/O Ground switch monitoring input with current source.
6 IN18 I/O Ground switch monitoring input with current source.
7 IN19 I/O Ground switch monitoring input with current source.
8 IN20 I/O Ground switch monitoring input with current source.
9 AGND P Ground for analog circuitry.
10 IN21 I/O Ground switch monitoring input with current source.
11 IN22 I/O Ground switch monitoring input with current source.
12 IN23 I/O Ground switch monitoring input with current source.
13 IN0 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
14 IN1 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
15 CS I Active-low input. Chip select from the controller for the SPI Interface.
16 SCLK I Serial clock output from the controller for the SPI Interface.
17 SI I Serial data input for the SPI Interface.
18 SO O Serial data output for the SPI Interface.
19 VDD P 3.3 V to 5.0 V logic supply for the SPI communication. The SPI I/Os are not fail-safe protected: VDD needs to be present during any SPI traffic to avoid excessive leakage currents and corrupted SPI I/O logic levels.
20 CAP_A I/O External capacitor connection for the analog LDO. Use capacitance value of 100 nF.
21 RESET I Keep RESET low for normal operation and drive RESET high and release it to perform a hardware reset of the device. The RESET pin is connected to ground via a 1MΩ pull-down resistor. If not used, the RESET pin shall be grounded to avoid any accidental device reset due to coupled noise onto this pin.
22 CAP_Pre I/O External capacitor connection for the pre-regulator. Use capacitance value of 1 μF.
23 CAP_D I/O External capacitor connection for the digital LDO. Use capacitance value of 100 nF.
24 INT O Open drain output. Pulled low (internally) upon change of state on the input or occurrence of a special event.
25 IN2 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
26 IN3 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
27 IN4 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
28 DGND P Ground for digital circuitry.
29 IN5 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
30 IN6 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
31 IN7 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
32 IN8 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
33 IN9 I/O Ground/VBAT switch monitoring input with configurable current sink or source.
34 IN10 I/O Ground switch monitoring input with current source.
35 IN11 I/O Ground switch monitoring input with current source.
36 IN12 I/O Ground switch monitoring input with current source.
37 VS P Power supply input pin.
38 VS P Power supply input pin.
--- EP P Exposed Pad. The exposed pad is not electrically connected to AGND or DGND. Connect EP to the board ground to achieve rated thermal and ESD performance.
(1) I = input, O = output, I/O = input and output, P = power.