SCPS260C August   2017  – February 2022 TIC12400-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VS Pin
      2. 8.3.2  VDD Pin
      3. 8.3.3  Device Initialization
      4. 8.3.4  Device Trigger
      5. 8.3.5  Device Reset
        1. 8.3.5.1 VS Supply POR
        2. 8.3.5.2 Hardware Reset
        3. 8.3.5.3 Software Reset
      6. 8.3.6  VS Under-Voltage (UV) Condition
      7. 8.3.7  VS Over-Voltage (OV) Condition
      8. 8.3.8  Switch Inputs Settings
        1. 8.3.8.1 Input Current Source and Sink Selection
        2. 8.3.8.2 Input Mode Selection
        3. 8.3.8.3 Input Enable Selection
        4. 8.3.8.4 Thresholds Adjustment
        5. 8.3.8.5 Wetting Current Configuration
      9. 8.3.9  Interrupt Generation and INT Assertion
        1. 8.3.9.1 INT Pin Assertion Scheme
        2. 8.3.9.2 Interrupt Idle Time (tINT_IDLE) Time
        3. 8.3.9.3 Microcontroller Wake-Up
        4. 8.3.9.4 Interrupt Enable or Disable and Interrupt Generation Conditions
        5. 8.3.9.5 Detection Filter
      10. 8.3.10 Temperature Monitor
        1. 8.3.10.1 Temperature Warning (TW)
        2. 8.3.10.2 Temperature Shutdown (TSD)
      11. 8.3.11 Parity Check and Parity Generation
      12. 8.3.12 Cyclic Redundancy Check (CRC)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Mode
      2. 8.4.2 Polling Mode
        1. 8.4.2.1 Standard Polling
        2. 8.4.2.2 Matrix polling
      3. 8.4.3 Additional Features
        1. 8.4.3.1 Clean Current Polling (CCP)
        2. 8.4.3.2 Wetting Current Auto-Scaling
        3. 8.4.3.3 VS Measurement
        4. 8.4.3.4 Wetting Current Diagnostic
        5. 8.4.3.5 ADC Self-Diagnostic
    5. 8.5 Programming
      1. 8.5.1 SPI Communication Interface Buses
        1. 8.5.1.1 Chip Select ( CS)
        2. 8.5.1.2 System Clock (SCLK)
        3. 8.5.1.3 Slave In (SI)
        4. 8.5.1.4 Slave Out (SO)
      2. 8.5.2 SPI Sequence
        1. 8.5.2.1 Read Operation
        2. 8.5.2.2 Write Operation
        3. 8.5.2.3 Status Flag
    6. 8.6 Register Maps
    7. 8.7 Programming Guidelines
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Using TIC12400-Q1 in a 12 V Automotive System
    3. 9.3 Resistor-coded Switches Detection in Automotive Body Control Module
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
      3. 9.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TIC12400-Q1UNIT
DCP (TSSOP)
38 PINS
RθJAJunction-to-ambient thermal resistance33.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance18.4°C/W
RθJBJunction-to-board thermal resistance15.2°C/W
ψJTJunction-to-top characterization parameter0.5°C/W
ψJBJunction-to-board characterization parameter15.0°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance1.2°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.