SLLSEV5D July   2017  – June 2019 TIOL111 , TIOL1113 , TIOL1115

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  Wake Up Detection
      2. 8.3.2  Current Limit Configuration
      3. 8.3.3  Current Fault Detection, Indication and Auto Recovery
      4. 8.3.4  Thermal Warning, Thermal Shutdown
      5. 8.3.5  Fault Reporting (NFAULT)
      6. 8.3.6  Transceiver Function Tables
      7. 8.3.7  The Integrated Voltage Regulator (LDO)
      8. 8.3.8  Reverse Polarity Protection
      9. 8.3.9  Integrated Surge Protection and Transient Waveform Tolerance
      10. 8.3.10 Power Up Sequence (TIOL111)
      11. 8.3.11 Undervoltage Lock-Out (UVLO)
    4. 8.4 Device Functional Modes
      1. 8.4.1 NPN Configuration (N-Switch SIO Mode)
      2. 8.4.2 PNP Configuration (P-Switch SIO Mode)
      3. 8.4.3 Push-Pull, Communication Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Maximum Junction Temperature Check
        2. 9.2.2.2 Driving Capacitive Loads
        3. 9.2.2.3 Driving Inductive Loads
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.