SLLSFS6A September   2024  – December 2024 TIOL221

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings - IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1  Wake-Up Detection
      2. 7.3.2  Current Limit Configuration
        1. 7.3.2.1 Current Limit Configuration in Pin-Mode
        2. 7.3.2.2 Current Limit Configuration in SPI mode
      3. 7.3.3  CQ Current Fault Detection, Indication and Auto Recovery
      4. 7.3.4  DO Current Fault Detection, Indication and Auto Recovery
      5. 7.3.5  CQ and DI Receivers
      6. 7.3.6  Fault Reporting
        1. 7.3.6.1 Thermal Warning, Thermal Shutdown
      7. 7.3.7  The Integrated Voltage Regulator (LDO)
      8. 7.3.8  Reverse Polarity Protection
      9. 7.3.9  Integrated Surge Protection and Transient Waveform Tolerance
      10. 7.3.10 Undervoltage Lock-Out (UVLO)
      11. 7.3.11 Interrupt Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 CQ and DO Tracking mode
    5. 7.5 SPI Programming
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Driving Capacitive Loads
        2. 8.2.2.2 Driving Inductive Loads
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 TIOL221 Registers
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGE|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • 7V to 36V supply voltage
  • IO-link configurable CQ output with auxiliary digital output (DO) and digital input (DI) channels
  • Configurable via pin-control or SPI interface

  • Both CQ and DO channels configurable for use in IO-link master modules

  • PNP, NPN or IO-Link configurable CQ output
    • IEC 61131-9 COM1, COM2 and COM3 Data Rate Support
  • Output drivers with low power dissipation and high configurability
    • Low RDSON 2.5Ω (typical)
    • Active driver current limiting capability
    • Configurable driver overcurrent limit:
      50mA to 500mA
    • Active reverse polarity protection of up to 65V on LP, CQ, DO and DI
    • Safe and fast demagnetization of inductive loads
  • Integrated protection features for robust systems
    • Fault indicator for overcurrent, overtemperature and UVLO faults
    • Extended ambient temperature operation:
      –40°C to 125°C
    • ±8kV IEC 61000-4-2 ESD contact discharge
    • ±4kV IEC 61000-4-4 electrical fast transient
    • ±1.2kV, 500Ω IEC 61000-4-5 surge
  • Large capacitive and inductive load driving capability
  • Integrated LDO provides up to 20mA current
  • Optional external regulator input (5V) to reduce internal power dissipation in the LDO
  • Small space-saving package options
    • 4mm x 4mm VQFN package
    • 2.7mm x 2.7mm DSBGA package