SLLSFL4B february   2022  – june 2023 TIOS102 , TIOS1023 , TIOS1025

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings - IEC Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  Current Limit Configuration
      2. 8.3.2  Current Fault Detection, Indication and Auto Recovery
      3. 8.3.3  Thermal Warning, Thermal Shutdown
      4. 8.3.4  Fault Reporting (NFAULT)
      5. 8.3.5  Device Function Tables
      6. 8.3.6  The Integrated Voltage Regulator (LDO)
      7. 8.3.7  Reverse Polarity Protection
      8. 8.3.8  Integrated Surge Protection and Transient Waveform Tolerance
      9. 8.3.9  Power Up Sequence
      10. 8.3.10 Undervoltage Lock-Out (UVLO)
    4. 8.4 Device Functional Modes
      1. 8.4.1 NPN Configuration (N-Switch Mode)
      2. 8.4.2 PNP Configuration (P-Switch Mode)
      3. 8.4.3 Push-Pull Mode
  10. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Maximum Junction Temperature Check
        2. 9.2.2.2 Driving Capacitive Loads
        3. 9.2.2.3 Driving Inductive Loads
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Information

THERMAL METRIC (1) TIOS102, TIOS1023, TIOS1025 TIOS102, TIOS1023L UNIT
DRC (10 Pins) YAH (12 Pins)
RθJA Junction-to-ambient thermal resistance 45.9 79.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 45.9 0.3 °C/W
RθJB Junction-to-board thermal resistance 17.9 19.5 °C/W
ψJT Junction-to-top characterization parameter 0.7 0.1 °C/W
ψJB Junction-to-board characterization parameter 17.8 19.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.7 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.