SLOS078N november   1978  – august 2023 TL061 , TL061A , TL061B , TL062 , TL062A , TL062B , TL064 , TL064A , TL064B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information (TL061)
    5. 6.5  Thermal Information (TL062)
    6. 6.6  Thermal Information (TL064)
    7. 6.7  Electrical Characteristics for TL06xC and TL06xxC
    8. 6.8  Electrical Characteristics for TL06xxC and TL06xI
    9. 6.9  Electrical Characteristics for TL06xM
    10. 6.10 Operating Characteristics
    11.     Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Common-Mode Rejection Ratio
      2. 8.3.2 Slew Rate
    4. 8.4 Device Functional Modes
  10. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Inverting Amplifier Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
    3. 9.3 System Examples
      1. 9.3.1 General Applications
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information (TL061)

THERMAL METRIC(1) TL061 UNIT
D (SOIC) P (PDIP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance(2)(3) 97 85 °C/W
RθJC(top) Junction-to-case (top) thermal resistance(4)(5) — — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
(4) Maximum power dissipation is a function of TJ(max), RθJC, and TC. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TC) / RθJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
(5) The package thermal impedance is calculated in accordance with MIL-STD-883.