SLOS081N February   1977  – June 2024 TL081 , TL081A , TL081B , TL081H , TL082 , TL082A , TL082B , TL082H , TL084 , TL084A , TL084B , TL084H

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information for Single Channel
    5. 5.5  Thermal Information for Dual Channel
    6. 5.6  Thermal Information for Quad Channel
    7. 5.7  Electrical Characteristics: TL08xH
    8. 5.8  Electrical Characteristics (DC): TL08xC, TL08xAC, TL08xBC, TL08xI, TL08xM
    9. 5.9  Electrical Characteristics (AC): TL08xC, TL08xAC, TL08xBC, TL08xI, TL08xM
    10. 5.10 Typical Characteristics: TL08xH
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Total Harmonic Distortion
      2. 7.3.2 Slew Rate
    4. 7.4 Device Functional Modes
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Inverting Amplifier Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 General Applications
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
  • PS|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TL08xH (TL081H, TL082H, and TL084H) family of devices are the next-generation versions of the industry-standard TL08x (TL081, TL082, and TL084) devices. These devices provide outstanding value for cost-sensitive applications, with features including low offset (1mV, typical), high slew rate (20V/μs), and common-mode input to the positive supply. High ESD (1.5kV, HBM), integrated EMI and RF filters, and operation across the full –40°C to 125°C enable the TL08xH devices to be used in the most rugged and demanding applications.

Device Information
PART NUMBER PACKAGE(1) BODY SIZE (NOM)(2)
TL081x P (PDIP, 8) 9.59mm × 6.35mm
DCK (SC70, 5) 2mm × 1.25mm
PS (SO, 8) 6.2mm × 5.3mm
D (SOIC, 8) 4.9mm × 3.9mm
DBV (SOT-23, 5) 2.9mm × 1.6mm
TL082x P (PDIP, 8) 9.59mm × 6.35mm
PS (SO, 8) 6.2mm × 5.3mm
D (SOIC, 8) 4.9mm × 3.9mm
DDF (SOT-23, 8) 2.9mm × 1.6mm
PW (TSSOP, 8) 4.4mm × 3mm
TL082M JG (CDIP, 8) 9.6mm × 6.67mm
FK (LCCC, 20) 8.89mm × 8.89mm
TL084x N (PDIP, 14) 19.3mm × 6.35mm
NS (SO, 14) 10.3mm × 5.3mm
D (SOIC, 14) 8.65mm × 3.91mm
DYY (SOT-23, 14) 4.2mm × 2mm
PW (TSSOP, 14) 5mm × 4.4mm
TL084M J (CDIP, 14) 19.56mm × 6.67mm
FK (LCCC, 20) 8.89mm × 8.89mm
(1) For more information, see Section 11.
(2) The body size (length × width) is a nominal value and does not include pins.
TL081 TL081A TL081B TL081H TL082 TL082A TL082B TL082H TL084 TL084A TL084B TL084H Logic Symbols Logic Symbols