SLOS081N February   1977  – June 2024 TL081 , TL081A , TL081B , TL081H , TL082 , TL082A , TL082B , TL082H , TL084 , TL084A , TL084B , TL084H

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information for Single Channel
    5. 5.5  Thermal Information for Dual Channel
    6. 5.6  Thermal Information for Quad Channel
    7. 5.7  Electrical Characteristics: TL08xH
    8. 5.8  Electrical Characteristics (DC): TL08xC, TL08xAC, TL08xBC, TL08xI, TL08xM
    9. 5.9  Electrical Characteristics (AC): TL08xC, TL08xAC, TL08xBC, TL08xI, TL08xM
    10. 5.10 Typical Characteristics: TL08xH
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Total Harmonic Distortion
      2. 7.3.2 Slew Rate
    4. 7.4 Device Functional Modes
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Inverting Amplifier Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 General Applications
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DDF|8
  • PW|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.9 Electrical Characteristics (AC): TL08xC, TL08xAC, TL08xBC, TL08xI, TL08xM

For VS = (VCC+) – (VCC–) = ±15V at TA = 25°C, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
 
SR Slew rate  VI = 10V, CL = 100pF, RL = 2kΩ TL08xM 5 20 V/μs
TL08xC, TL08xAC,
TL08xBC, TL08xI		 8 20 V/μs
tS Settling time VI = 20V, CL = 100pF, RL = 2kΩ 0.1 μs
20%
eN Input voltage noise density All PS and NS packages; All TL08xM devices RS = 20 Ω, f = 1kHz 18   nV/√Hz
All other devices  f = 1kHz 37   nV/√Hz
f = 10kHz   21  
EN Input voltage noise All PS and NS packages; All TL08xM devices RS = 20 Ω, f = 10Hz to 10kHz   4 μVRMS
All other devices f = 0.1Hz to 10Hz   1.4   µVRMS
iN Input current noise RS = 20 Ω, f = 1kHz   10 fA/√Hz
Phase margin TL08xC, TL08xAC, TL08xBC, TL08xI G = +1, RL = 10kΩ, CL = 20pF 56 °
Overload recovery time VIN  × gain > VS 300 ns
THD+N Total harmonic distortion + noise All PS and NS packages; All TL08xM devices VO = 6VRMS, RL ≥ 2kΩ, f = 1kHz, G = +1, RS ≤ 1kΩ 0.003 %
All other devices  VS = 40V, VO = 6VRMS, G = +1, f = 1kHz 0.00012 %
EMIRR EMI rejection ratio TL08xC, TL08xAC, TL08xBC, TL08xI f = 1GHz 53 dB
ZO Open-loop output impedance TL07xC, TL07xAC, TL07xBC, TL07xI f = 1MHz, IO = 0 A 125 Ω