SLOS081N February   1977  – June 2024 TL081 , TL081A , TL081B , TL081H , TL082 , TL082A , TL082B , TL082H , TL084 , TL084A , TL084B , TL084H

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information for Single Channel
    5. 5.5  Thermal Information for Dual Channel
    6. 5.6  Thermal Information for Quad Channel
    7. 5.7  Electrical Characteristics: TL08xH
    8. 5.8  Electrical Characteristics (DC): TL08xC, TL08xAC, TL08xBC, TL08xI, TL08xM
    9. 5.9  Electrical Characteristics (AC): TL08xC, TL08xAC, TL08xBC, TL08xI, TL08xM
    10. 5.10 Typical Characteristics: TL08xH
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Total Harmonic Distortion
      2. 7.3.2 Slew Rate
    4. 7.4 Device Functional Modes
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Inverting Amplifier Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 General Applications
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • N|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information for Dual Channel

THERMAL METRIC (1) TL082xx UNIT
D 
(SOIC)		 DDF
(SOT-23)		 FK
(LCCC)		 JG
(CDIP)		 P 
(PDIP)		 PS
(SO)		 PW
(TSSOP)		 U
(CFP)
8 PINS 8 PINS 20 PINS 8 PINS 8 PINS 8 PINS 8 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 147.8 181.5 – – 85 95 200.3 169.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 88.2 112.5 5.61 15.05 – – 89.4 62.1 °C/W
RθJB Junction-to-board thermal resistance 91.4 98.2 – – – – 131.0 176.2 °C/W
ψJT Junction-to-top characterization parameter 36.8 17.2 – – – – 22.2 48.4 °C/W
ψJB Junction-to-board characterization parameter 90.6 97.6 – – – – 129.3 144.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A – – – – N/A 5.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.