SLLS177I March   1994  – March 2021 TL16C550C

PRODUCTION DATA  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Recommended Operating Conditions (Low Voltage - 3.3 nominal)
    3. 5.3  Recommended Operating Conditions (Standard Voltage - 5 V nominal)
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics (Low Voltage - 3.3 V nominal)
    6. 5.6  Electrical Characteristics (Standard Voltage - 5 V nominal)
    7. 5.7  System Timing Requirements
    8. 5.8  System Switching Characteristics
    9. 5.9  Baud Generator Switching Characteristics
    10. 5.10 Receiver Switching Characteristics
    11. 5.11 Transmitter Switching Characteristics
    12. 5.12 Modem Control Switching Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Autoflow Control (see Figure 1-1)
    2. 7.2 Auto-RTS (see Figure 1-1)
    3. 7.3 Auto-CTS (see Figure 1-1)
    4. 7.4 Enabling Autoflow Control and Auto-CTS
    5. 7.5 Auto-CTS and Auto-RTS Functional Timing
    6. 7.6 Functional Block Diagram
    7. 7.7 Principles of Operation
      1. 7.7.1  Accessible Registers
      2. 7.7.2  FIFO Control Register (FCR)
      3. 7.7.3  FIFO Interrupt Mode Operation
      4. 7.7.4  FIFO Polled Mode Operation
      5. 7.7.5  Interrupt Enable Register (IER)
      6. 7.7.6  Interrupt Identification Register (IIR)
      7. 7.7.7  Line Control Register (LCR)
      8. 7.7.8  Line Status Register (LSR)
      9. 7.7.9  Modem Control Register (MCR)
      10. 7.7.10 Modem Status Register (MSR)
      11. 7.7.11 Programming Baud Generator
      12. 7.7.12 Receiver Buffet Register (RBR)
      13. 7.7.13 Scratch Register
      14. 7.7.14 Transmitter Holding Register (THR)
  8. 8 Application Information
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TL16C550C

TL16C550C

 TL16C550C UNIT
PT

PFB

FN
48 PINS

48 PINS

44 PINS
RθJA Junction-to-ambient thermal resistance

72.5

73.6

62.4

 °C/W
RθJC(top) Junction-to-case (top) thermal resistance

31.0

26.3

37.2

 °C/W
RθJB Junction-to-board thermal resistance

36.2

37.2

39.1

 °C/W
ψJT Junction-to-top characterization parameter

4.4

1.9

19.4

 °C/W
ψJB Junction-to-board characterization parameter

36.0

37.0

38.7

 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.