SLLS646C March   2008  – June 2017 TL16C752C

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Functional Description
        1. 8.3.1.1  Trigger Levels
        2. 8.3.1.2  Hardware Flow Control
        3. 8.3.1.3  Auto-RTS
        4. 8.3.1.4  Auto-CTS
        5. 8.3.1.5  Software Flow Control
        6. 8.3.1.6  Software Flow Control Example
        7. 8.3.1.7  Reset
        8. 8.3.1.8  Interrupts
        9. 8.3.1.9  Interrupt Mode Operation
        10. 8.3.1.10 Polled Mode Operation
        11. 8.3.1.11 Break and Timeout Conditions
        12. 8.3.1.12 Programmable Baud Rate Generator
    4. 8.4 Device Functional Modes
      1. 8.4.1 DMA Signaling
        1. 8.4.1.1 Single DMA Transfers (DMA Mode0 or FIFO Disable)
        2. 8.4.1.2 Block DMA Transfers (DMA Mode 1)
      2. 8.4.2 Sleep Mode
    5. 8.5 Register Maps
      1. 8.5.1  Principals of Operation
      2. 8.5.2  Receiver Holding Register (RHR)
      3. 8.5.3  Transmit Holding Register (THR)
      4. 8.5.4  FIFO Control Register (FCR)
      5. 8.5.5  Line Control Register (LCR)
      6. 8.5.6  Line Status Register (LSR)
      7. 8.5.7  Modem Control Register (MCR)
      8. 8.5.8  Modem Status Register (MSR)
      9. 8.5.9  Interrupt Enable Register (IER)
      10. 8.5.10 Interrupt Identification Register (IIR)
      11. 8.5.11 Enhanced Feature Register (EFR)
      12. 8.5.12 Divisor Latches (DLL, DLH)
      13. 8.5.13 Transmission Control Register (TCR)
      14. 8.5.14 Trigger Level Register (TLR)
      15. 8.5.15 FIFO Ready Register
      16. 8.5.16 Alternate Function Register (AFR)
      17. 8.5.17 RS-485 Mode
      18. 8.5.18 IrDA Overview
      19. 8.5.19 IrDA Encoder Function
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resource
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation see the following:

TL16C752C/TL16C754C/TL16C2752 Short STOP Bit Errata, SLLZ058

12.2 Community Resource

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.