SLVS038J January   1989  – October 2024 TL2842 , TL2843 , TL2844 , TL2845 , TL3842 , TL3843 , TL3844 , TL3845

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Pulse-by-Pulse Current Limiting
      2. 6.3.2 Error Amplifier With Low Output Resistance
      3. 6.3.3 High-Current Totem-Pole Output
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Technique
      2. 6.4.2 Slope Compensation
  8. 7 Application and Implementation
    1. 7.1 Typical Application
      1. 7.1.1 Design Requirements
      2. 7.1.2 Detailed Design Procedure
        1. 7.1.2.1 Current-Sense Circuit
        2. 7.1.2.2 Error-Amplifier Configuration
        3. 7.1.2.3 Oscillator Section
      3. 7.1.3 Application Curve
    2. 7.2 Power Supply Recommendations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
        1. 7.3.1.1 Feedback Traces
        2. 7.3.1.2 Input/Output Capacitors
        3. 7.3.1.3 Compensation Components
        4. 7.3.1.4 Traces and Ground Planes
      2. 7.3.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • D|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TLx84x UNIT
D (SOIC) D (SOIC) P (PDIP)
8 PINS 14 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 117.4 87.9 74.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.